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HN62444BFBN-12

Description
MASK ROM, 256KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44
Categorystorage    storage   
File Size122KB,6 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
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HN62444BFBN-12 Overview

MASK ROM, 256KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44

HN62444BFBN-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
Parts packaging codeSOIC
package instructionSOP, SOP44,.63
Contacts44
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time120 ns
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length28.5 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width16
Number of functions1
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP44,.63
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height3.22 mm
Maximum standby current0.00003 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width12.6 mm
This Material Copyrighted By Its Respective Manufacturer

HN62444BFBN-12 Related Products

HN62444BFBN-12 HN62444BPN-12 HN62444BCPN-12
Description MASK ROM, 256KX16, 120ns, CMOS, PDSO44, PLASTIC, SOP-44 MASK ROM, 256KX16, 120ns, CMOS, PDIP40, PLASTIC, DIP-40 MASK ROM, 256KX16, 120ns, CMOS, PQCC44, PLASTIC, LCC-44
Is it Rohs certified? incompatible incompatible incompatible
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code SOIC DIP LCC
package instruction SOP, SOP44,.63 DIP, DIP40,.6 QCCJ, LDCC44,.7SQ
Contacts 44 40 44
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 120 ns 120 ns 120 ns
JESD-30 code R-PDSO-G44 R-PDIP-T40 S-PQCC-J44
JESD-609 code e0 e0 e0
length 28.5 mm 52.8 mm 16.5862 mm
memory density 4194304 bit 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM MASK ROM
memory width 16 16 16
Number of functions 1 1 1
Number of terminals 44 40 44
word count 262144 words 262144 words 262144 words
character code 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 256KX16 256KX16 256KX16
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP QCCJ
Encapsulate equivalent code SOP44,.63 DIP40,.6 LDCC44,.7SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form SMALL OUTLINE IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.22 mm 5.08 mm 4.6 mm
Maximum standby current 0.00003 A 0.00003 A 0.00003 A
Maximum slew rate 0.12 mA 0.12 mA 0.12 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE J BEND
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
width 12.6 mm 15.24 mm 16.5862 mm
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