1206SFP100F datasheet, PDF - EEWORLD Datasheet

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1206SFP100F: DescriptionSurface-mount Fuses Fundamentals; File Size1MB，28 Pages; ManufacturerMACOM; Websitehttp://www.macom.com

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1206SFP100F Overview

Surface-mount Fuses Fundamentals

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Surface-mount Fuses

– Fundamentals

Surface-mount Fuses

Fundamentals

Overview

TE Circuit Protection offers the widest selection of surface-mount

fuses available for addressing a broad range of overcurrent

protection applications. Helping to prevent costly damage and

promote a safe environment for electronic and electrical

equipment, our single-use chip fuses provide performance stability

to support applications with current ratings from .5A up to 20A.

TE Circuit Protection also offers the telecom FT600 fuse for

telecommunications applications. This telecom fuse helps comply

with North American overcurrent protection requirements,

including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),

and UL60950 3rd edition.

Multi-layer Design for Chip Fuses

The multi-layer design has the benefit of exposing more fuse

element surface area to the glass-ceramic absorption material.

When the fuse elements open, there is more material for the

vaporizing fuse metals to absorb into, resulting in a very efficient

and effective quenching of the fuse arc.

Figure 1 compared the multi-layer design of our SFF fuses with

standard glass coated designs. The glass coated designs rely on

the coating on only one side of the fuse element to absorb the

vaporizing fuse material when it opens. Therefore, there is much

less absorption material available to absorb the fuse metals. The

result can be prolonged arcing and possible coating breach.

Figure 2 shows how the absorption characteristics of the two

designs differ. The multi-layer design indicates a clean separation

with the fuse element evenly diffusing into the surrounding

ceramic substrate. In the glass coated design, the element

diffusion takes place in a small portion of the device and is only

absorbed by the glass material directly above the area of failure.

Figure 1

Glass/Ceramic

Substrate

Multiple Fuse

Elements

Substrate

Material

Single Fuse Glass

Element Coating

Multi-layer Design

Single-layer Glass Coated Design

Figure 2

Fault Zones

Multi-layer Design

Single-layer Glass Coated Design

Wire-In-Air Design for 2410SFV Fuses

The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable

for secondary level over current protection applications.

Figure 3 compared our straight wire element design 2410SFV

fuses with normal corrugating wire design fuse. The straight wire

element in air performs consistent fusing and cutting

characteristics together with excellent inrush current

withstanding capability.

Introduced PCB assembly technology into 2410SFV fuses design

and manufacture, we achieved on lead free completely and no

end cap falling off risk comparing with traditional ceramic body

with end cap fuse.

Figure 3

Glass fiber enforced

epoxy body

Straight wire element

Copper terminal

plated with Ni and Tin

Ceramic body

Corrugate wire element

End cap plated with Tin

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