FLASH METHOD ADC, ACCESS, CDIP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Maximum analog input voltage | 7.3 V |
| Minimum analog input voltage | -0.3 V |
| Maximum conversion time | 2.5 µs |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| Number of analog input channels | 1 |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output bit code | BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Sample and hold/Track and hold | TRACK |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 15 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| PM0820BR | PM0820AR | PM0820EP | PM0820ER | PM0820FR | |
|---|---|---|---|---|---|
| Description | FLASH METHOD ADC, ACCESS, CDIP20 | FLASH METHOD ADC, ACCESS, CDIP20 | FLASH METHOD ADC, ACCESS, PDIP20 | FLASH METHOD ADC, ACCESS, CDIP20 | FLASH METHOD ADC, ACCESS, CDIP20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Contacts | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown | unknown |
| Maximum analog input voltage | 7.3 V | 7.3 V | 7.3 V | 7.3 V | 7.3 V |
| Minimum analog input voltage | -0.3 V | -0.3 V | -0.3 V | -0.3 V | -0.3 V |
| Maximum conversion time | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | R-GDIP-T20 | R-GDIP-T20 | R-PDIP-T20 | R-GDIP-T20 | R-GDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Sample and hold/Track and hold | TRACK | TRACK | TRACK | TRACK | TRACK |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.33 mm | 5.08 mm | 5.08 mm |
| Maximum slew rate | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Maker | ADI | - | - | ADI | ADI |
| Number of analog input channels | 1 | - | - | 1 | 1 |
京公网安备 11010802033920号
EEWORLD
