Micro Peripheral IC, ECL, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| surface mount | NO |
| technology | ECL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AMZ8127DM | AMZ8127DCB | AMZ8127DMB | AMZ8127LCB | AMZ8127XM | AMZ8127LM | AMZ8127XC | |
|---|---|---|---|---|---|---|---|
| Description | Micro Peripheral IC, ECL, CDIP24, | Micro Peripheral IC, ECL, CDIP24 | Micro Peripheral IC, ECL, CDIP24, | Micro Peripheral IC, ECL, CQCC28 | Micro Peripheral IC, ECL | Micro Peripheral IC, ECL, CQCC28 | Micro Peripheral IC, ECL |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | compliant | unknow |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -55 °C | - | -55 °C | - | -55 °C | -55 °C | - |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIE OR CHIP | LCC28,.45SQ | DIE OR CHIP |
| technology | ECL | ECL | ECL | ECL | ECL | ECL | ECL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | incompatible | - |
| Maker | AMD | - | - | - | AMD | AMD | AMD |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | - | QCCN, LCC28,.45SQ | , DIE OR CHIP | QCCN, LCC28,.45SQ | , DIE OR CHIP |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | S-XQCC-N28 | - | S-XQCC-N28 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | - |
| Number of terminals | 24 | 24 | 24 | 28 | - | 28 | - |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | - |
| encapsulated code | DIP | DIP | DIP | QCCN | - | QCCN | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - | SQUARE | - |
| Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | - | CHIP CARRIER | - |
| Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | YES | - | YES | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | NO LEAD | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | - |
| Terminal location | DUAL | DUAL | DUAL | QUAD | - | QUAD | - |
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