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ECHU1H223MB5

Description
Film Chip Capacitor
File Size62KB,2 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
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ECHU1H223MB5 Overview

Film Chip Capacitor

Film Chip Capacitor
Type:
ECHU (B)
Stacked metallized PPS film as dielectric with simple
mold-less construction
■Features
Small in size (minimum size 2.0
1.25mm)
85˚C, 85%RH, W.V.
1.0 for 500 hours
Applicable for both flow and reflow soldering
Time-constant
Filtering
Oscillation and resonance
■Explanation
of Part Numbers
1
2
3
4
E
C
H
U
Product code
Dielectric &
construction
Rated voltage
■Specifications
Category temp. range
Rated voltage
Capacitance range
Capacitance tolerance
Withstand voltage
Dissipation factor
Insulation resistance
N
Soldering conditions
■Construction
FO
RE
R
CO
N
EW M
M
D E
ES N
D
IG E
N D
S
5
6
7
8
9
10
11
12
■Recommended
Applications
B
Capacitance
Cap. Tol. Suffix
Suffix
1C
1H
16VDC
50VDC
G
J
±2%
±5%
Tape width
8mm
12mm
5
9
–55 to +125˚C
16VDC, 50VDC
0.0001 to 0.1 µF (E12)
±2%(G), ±5%(J)
T
O
Between terminals : Rated volt. (VDC)
175% 1 to 5s
<
0.6%
=
(20˚C, 1kHz)
>
16VDC :
=
3000MΩ (20˚C, 10VDC 60s)
>
50VDC :
=
3000MΩ (20˚C, 50VDC 60s)
Flow soldering : 260˚C max. 5sec max.
Reflow soldering : 260˚C max. and 30sec max. at more than 230˚C
(Temp. at cap. surface)
■Dimensions
in mm (not to scale)
(±0.3)
W±0.2
Size code
J1
J2
H1
H2
H3
G1
G2
G3
E1
E2
L
2.0
2.0
3.2
3.2
3.2
3.2
3.2
3.2
4.8
4.8
W
1.25
1.25
1.6
1.6
1.6
2.5
2.5
2.5
3.3
3.3
H
0.8
1.0
0.8
1.0
1.4
1.0
1.4
2.0
1.4
2.0
L±0.2
0.35±0.20
Element
(stacked)
Outer electrode
0.35±0.20
To be applied
only for size
code E1 & E2
H±0.2

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Index Files: 2901  1710  1734  2717  873  59  35  55  18  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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