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A2F060M3B-1FGG256Y

Description
FPGA, 1536 CLBS, 60000 GATES, PBGA256
CategoryProgrammable logic devices    Programmable logic   
File Size12MB,197 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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A2F060M3B-1FGG256Y Overview

FPGA, 1536 CLBS, 60000 GATES, PBGA256

A2F060M3B-1FGG256Y Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionLBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length17 mm
Humidity sensitivity level3
Configurable number of logic blocks1536
Equivalent number of gates60000
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature
organize1536 CLBS, 60000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)250
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Maximum seat height1.7 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
Base Number Matches1
Revision 13
SmartFusion Customizable System-on-Chip (cSoC)
Microcontroller Subsystem (MSS)
Hard 100 MHz 32-bit ARM
®
Cortex
®
-M3 Processor
– 1.25 DMIPS/MHz Throughput from Zero Wait State
Memory
– Memory Protection Unit (MPU)
– Single Cycle Multiplication, Hardware Divide
– JTAG Debug (4 wires), Serial Wire Debug (SWD, 2
wires), and Single Wire Viewer (SWV) Interfaces
Internal Memory
– Embedded Nonvolatile Flash Memory (eNVM), 128
Kbytes to 512 Kbytes
– Embedded High-Speed SRAM (eSRAM), 16 Kbytes
to 64 Kbytes, Implemented in 2 Physical Blocks to
Enable Simultaneous Access from 2 Different
Masters
Multi-Layer AHB Communications Matrix
– Provides up to 16 Gbps of On-Chip Memory
Bandwidth,
1
Allowing Multi-Master Schemes
10/100 Ethernet MAC with RMII Interface
2
Programmable External Memory Controller, Which
Supports:
– Asynchronous Memories
– NOR Flash, SRAM, PSRAM
– Synchronous SRAMs
Two I
2
C Peripherals
Two 16550 Compatible UARTs
Two SPI Peripherals
Two 32-bit Timers
32-bit Watchdog Timer
8-channel DMA Controller to Offload the Cortex-M3 from
Data Transactions
Clock Sources
– 32 KHz to 20 MHz Main Oscillator
– Battery-Backed 32 KHz Low Power Oscillator with
Real-Time Counter (RTC)
– 100 MHz Embedded RC Oscillator; 1% Accurate
– Embedded Analog PLL with 4 Output Phases (0, 90,
180, 270)
Based on proven ProASIC
®
3 FPGA Fabric
Low Power, Firm-Error Immune 130-nm, 7-Layer Metal,
Flash-Based CMOS Process
Nonvolatile, Instant On, Retains Program When
Powered Off
350 MHz System Performance
Embedded SRAMs and FIFOs
– Variable Aspect Ratio 4,608-Bit SRAM Blocks
– x1, x2, x4, x9, and x18 Organizations
– True Dual-Port SRAM (excluding x18)
– Programmable Embedded FIFO Control Logic
Secure ISP with 128-bit AES via JTAG
FlashLock
®
to Secure FPGA Contents
Five Clock Conditioning Circuits (CCCs) with up to 2
Integrated Analog PLLs
– Phase Shift, Multiply/Divide, and Delay Capabilities
– Frequency: Input 1.5–350 MHz, Output 0.75 to
350 MHz
Programmable Analog
Analog Front-End (AFE)
Up to Three 12-Bit SAR ADCs
– 500 Ksps in 12-Bit Mode
– 550 Ksps in 10-Bit Mode
– 600 Ksps in 8-Bit Mode
Internal 2.56 V Reference or Optional External
Reference
One First-Order

DAC (sigma-delta) per ADC
– 8-Bit, 16-Bit, or 24-Bit 500 Ksps Update Rate
Up to 5 High-Performance Analog Signal Conditioning
Blocks (SCB) per Device, Each Including:
– Two High-Voltage Bipolar Voltage Monitors (with 4
input ranges from ±2.5 V to –11.5/+14 V) with 1%
Accuracy
– High Gain Current Monitor, Differential Gain = 50, up
to 14 V Common Mode
– Temperature Monitor (Resolution = ¼°C in 12-Bit
Mode; Accurate from –55°C to 150°C)
Up to Ten High-Speed Voltage Comparators
(t
pd
= 15 ns)
Analog Compute Engine (ACE)
High-Performance FPGA
Offloads Cortex-M3–Based MSS from Analog
Initialization and Processing of ADC, DAC, and SCBs
Sample Sequence Engine for ADC and DAC Parameter
Set-Up
Post-Processing Engine for Functions such as Low-
Pass Filtering and Linear Transformation
Easily Configured via GUI in Libero
®
System-on-Chip
(SoC) Software
FPGA I/Os
– LVDS, PCI, PCI-X, up to 24 mA IOH/IOL
– Up to 350 MHz
MSS I/Os
– Schmitt Trigger, up to 6 mA IOH, 8 mA IOL
– Up to 180 MHz
Single 3.3 V Power Supply with On-Chip 1.5 V Regulator
External 1.5 V Is Allowed by Bypassing Regulator
(digital VCC = 1.5 V for FPGA and MSS, analog VCC =
3.3 V and 1.5 V)
I/Os and Operating Voltage
1 Theoretical maximum
2 A2F200 and larger devices
March 2015
© 2015 Microsemi Corporation
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