UPD70F3358GJ(A)-UEN-A datasheet, PDF

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UPD70F3358GJ(A)-UEN-A: DescriptionUPD70F3358GJ(A)-UEN-A; CategoryThe embedded processor and controller Microcontrollers and processors; File Size7MB，1174 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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UPD70F3358GJ(A)-UEN-A Overview

UPD70F3358GJ(A)-UEN-A

UPD70F3358GJ(A)-UEN-A Parametric

Parameter Name	Attribute value
Brand Name	Renesas
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	LFQFP
package instruction	20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144
Contacts	144
Manufacturer packaging code	PLQP0144KD-D144
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Has ADC	YES
Address bus width	24
bit size	32
CPU series	V850
maximum clock frequency	32 MHz
DAC channel	YES
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G144
JESD-609 code	e6
length	20 mm
Number of I/O lines	128
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP144,.87SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Certification status	Not Qualified
RAM (bytes)	61440
rom(word)	1048576
ROM programmability	FLASH
Filter level	AEC-Q100
Maximum seat height	1.6 mm
speed	32 MHz
Maximum slew rate	64 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.85 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN BISMUTH
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

User Manual

UPD70F3358GJ(A)-UEN-A Preview

User’s Manual

V850ES/SJ3

User’s Manual: Hardware

RENESAS MCU

V850ES/Sx3 Microcontrollers

μPD70F3344(A)

μPD70F3345(A)

μPD70F3346(A)

μPD70F3347(A)

μPD70F3348(A)

μPD70F3354(A)

μPD70F3355(A)

μPD70F3356(A)

μPD70F3357(A)

μPD70F3358(A)

μPD70F3364(A)

μPD70F3365(A)

μPD70F3366(A)

μPD70F3367(A)

μPD70F3368(A)

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Electronics Corp. without notice. Please review the latest information published by

Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

website (http://www.renesas.com).

www.renesas.com

Rev.5.00

Feb 2012

Notice

All information included in this document is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to

additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights

of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights

of Renesas Electronics or others.

You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,

and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by

you or third parties arising from the use of these circuits, software, or information.

When exporting the products or technology described in this document, you should comply with the applicable export control

laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by

the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and

technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited

under any applicable domestic or foreign laws or regulations.

Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages

incurred by you resulting from errors in or omissions from the information included herein.

Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as

indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular

application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior

written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for

which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way

liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an

application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written

consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise

expressly specified in a Renesas Electronics data sheets or data books, etc.

Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-

crime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”:

Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or

systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare

intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or

damages arising out of the use of Renesas Electronics products beyond such specified ranges.

Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have

specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to

guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire

control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because

the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system

manufactured by you.

Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental

compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable

laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS

Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with

applicable laws and regulations.

This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this

document or Renesas Electronics products, or if you have any other inquiries.

“Standard”:

10.

11.

12.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-

owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

NOTES FOR CMOS DEVICES

(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a

reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL

(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise

from entering the device when the input level is fixed, and also in the transition period when the input level

passes through the area between VIL (MAX) and VIH (MIN).

(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If

an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of

CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be

connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling

related to unused pins must be judged separately for each device and according to related specifications

governing the device.

(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause

destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop

generation of static electricity as much as possible, and quickly dissipate it when it has occurred.

Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended

to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and

transported in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work benches and floors should be grounded. The operator should be grounded using a wrist

strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken

for PW boards with mounted semiconductor devices.

(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS

device. Immediately after the power source is turned ON, devices with reset functions have not yet been

initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A

device is not initialized until the reset signal is received. A reset operation must be executed immediately

after power-on for devices with reset functions.

(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal

operation and external interface, as a rule, switch on the external power supply after switching on the internal

power supply. When switching the power supply off, as a rule, switch off the external power supply and then

the internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements

due to the passage of an abnormal current. The correct power on/off sequence must be judged separately

for each device and according to related specifications governing the device.

(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply

while the device is not powered. The current injection that results from input of such a signal or I/O pull-up

power supply may cause malfunction and the abnormal current that passes in the device at this time may

cause degradation of internal elements. Input of signals during the power off state must be judged

separately for each device and according to related specifications governing the device.

How to Use This Manual

Readers

This manual is intended for users who wish to understand the functions of the

V850ES/SJ3 and design application systems using the V850ES/SJ3.

Purpose

This manual is intended to give users an understanding of the hardware functions of

the V850ES/SJ3 shown in the

Organization

below.

Organization

This manual is divided into two parts: Hardware (this manual) and Architecture

(V850ES

Architecture User’s Manual).

Hardware

•

Pin functions

•

CPU function

•

On-chip peripheral functions

•

Flash memory programming

•

Electrical specifications

How to Read This Manual

Architecture

•

Data types

•

Instruction format and instruction set

•

Interrupts and exceptions

•

Pipeline operation

It is assumed that the readers of this manual have general knowledge in the fields

of electrical engineering, logic circuits, and microcontrollers.

Cautions 1. The application examples in this manual apply to “standard”

quality grade products for general electronic systems.

When

using an example in this manual for an application that requires

a “special” quality grade product, thoroughly evaluate the

component and circuit to be actually used to see if they satisfy

the special quality grade.

2. When using this manual as a manual for a special grade product,

read the part numbers as follows.

PD70F3344

PD70F3345

PD70F3346

PD70F3347

PD70F3348

PD70F3354

PD70F3355

PD70F3356

PD70F3357

PD70F3358

PD70F3364

PD70F3365

PD70F3366

PD70F3367

PD70F3368

→

PD70F3344(A)

PD70F3345(A)

PD70F3346(A)

PD70F3347(A)

PD70F3348(A)

PD70F3354(A)

PD70F3355(A)

PD70F3356(A)

PD70F3357(A)

PD70F3358(A)

PD70F3364(A)

PD70F3365(A)

PD70F3366(A)

PD70F3367(A)

PD70F3368(A)

To understand the overall functions of the V850ES/SJ3

→

Read this manual according to the

CONTENTS.

To find the details of a register where the name is known

→

Use

APPENDIX C REGISTER INDEX.

→

The name of the bit whose number is in angle brackets (<>) in the figure of the

To understand the details of an instruction function

→

See the

V850ES Architecture User’s Manual

available separately.

To know the electrical specifications of the V850ES/SJ3

→

See

CHAPTER 32 ELECTRICAL SPECIFICATIONS.

The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual.

Note with caution that if “xxx.yyy” is described as is in a program, however, the

compiler/assembler cannot recognize it correctly.

The mark <R> shows major revised points.

field.

Conventions

Data significance:

Active low representation:

Memory map address:

Note:

Caution:

Remark:

Numeric representation:

Higher digits on the left and lower digits on the right

xxx (overscore over pin or signal name)

Higher addresses on the top and lower addresses

on the bottom

Footnote for item marked with

Note

in the text

Information requiring particular attention

Supplementary information

Binary ... xxxx or xxxxB

Decimal ... xxxx

Hexadecimal ... xxxxH

Prefix indicating power of 2

(address space, memory

capacity):

K (kilo): 2

= 1,024

M (mega): 2

= 1,024

G (giga): 2

= 1,024

The revised points can be easily

searched by copying an “<R>” in the PDF file and specifying it in the “Find what:”

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