UPD780021AGC-XXX-AB8 datasheet, PDF - EEWORLD Datasheet

EEWORLDEEWORLD

Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> UPD780021AGC-XXX-AB8

PDF

UPD780021AGC-XXX-AB8: Description8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, PLASTIC, QFP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，603 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

Download Datasheet Parametric View All

UPD780021AGC-XXX-AB8 Overview

8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, PLASTIC, QFP-64

UPD780021AGC-XXX-AB8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	QFP,
Contacts	64
Reach Compliance Code	unknown
Has ADC	YES
Other features	ALSO OPERATES AT 1.8V MINIMUM SUPPLY
Address bus width	16
bit size	8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQFP-G64
JESD-609 code	e0
length	14 mm
Number of I/O lines	51
Number of terminals	64
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	2.85 mm
speed	12 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	MOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

Preview

Download Datasheet

User’s Manual

µ

PD780024A, 780034A, 780024AY, 780034AY Subseries

8-Bit Single-Chip Microcontrollers

µ

PD780021A

µ

PD780022A

µ

PD780023A

µ

PD780024A

µ

PD780021A(A)

µ

PD780022A(A)

µ

PD780023A(A)

µ

PD780024A(A)

µ

PD780031A

µ

PD780032A

µ

PD780033A

µ

PD780034A

µ

PD780031A(A)

µ

PD780032A(A)

µ

PD780033A(A)

µ

PD780034A(A)

µ

PD78F0034A

µ

PD78F0034B

µ

PD78F0034B(A)

µ

PD780021AY

µ

PD780022AY

µ

PD780023AY

µ

PD780024AY

µ

PD780021AY(A)

µ

PD780022AY(A)

µ

PD780023AY(A)

µ

PD780024AY(A)

µ

PD780031AY

µ

PD780032AY

µ

PD780033AY

µ

PD780034AY

µ

PD780031AY(A)

µ

PD780032AY(A)

µ

PD780033AY(A)

µ

PD780034AY(A)

µ

PD78F0034AY

µ

PD78F0034BY

µ

PD78F0034BY(A)

Document No. U14046EJ5V0UD00 (5th edition)

Date Published March 2005 N CP(K)

©

Printed in Japan

1999, 2003

NOTES FOR CMOS DEVICES

1

VOLTAGE APPLICATION WAVEFORM AT INPUT PIN

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the

CMOS device stays in the area between V

IL

(MAX) and V

IH

(MIN) due to noise, etc., the device may

malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,

and also in the transition period when the input level passes through the area between V

IL

(MAX) and

V

IH

(MIN).

2

HANDLING OF UNUSED INPUT PINS

Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is

possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS

devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed

high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V

DD

or GND

via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must

be judged separately for each device and according to related specifications governing the device.

3

PRECAUTION AGAINST ESD

A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as

much as possible, and quickly dissipate it when it has occurred.

Environmental control must be

adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that

easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static

container, static shielding bag or conductive material. All test and measurement tools including work

benches and floors should be grounded.

The operator should be grounded using a wrist strap.

Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for

PW boards with mounted semiconductor devices.

4

STATUS BEFORE INITIALIZATION

Power-on does not necessarily define the initial status of a MOS device. Immediately after the power

source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does

not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the

reset signal is received. A reset operation must be executed immediately after power-on for devices

with reset functions.

5

POWER ON/OFF SEQUENCE

In the case of a device that uses different power supplies for the internal operation and external

interface, as a rule, switch on the external power supply after switching on the internal power supply.

When switching the power supply off, as a rule, switch off the external power supply and then the

internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal

elements due to the passage of an abnormal current.

The correct power on/off sequence must be judged separately for each device and according to related

specifications governing the device.

6

INPUT OF SIGNAL DURING POWER OFF STATE

Do not input signals or an I/O pull-up power supply while the device is not powered. The current

injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and

the abnormal current that passes in the device at this time may cause degradation of internal elements.

Input of signals during the power off state must be judged separately for each device and according to

related specifications governing the device.

User’s Manual U14046EJ5V0UD

3

These commodities, technology or software, must be exported in accordance

with the export administration regulations of the exporting country.

Diversion contrary to the law of that country is prohibited.

•

The information in this document is current as of February, 2005. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

M8E 02. 11-1

User’s Manual U14046EJ5V0UD

5

Recommended Resources

Three-phase four-wire load star connection circuit

Wind energy battery charger circuit

Amplitude modulation circuit composed of analog multiplier

LT1073 Several circuits for reducing ripple in voltage conversion circuits

Circuit diagram of low-frequency final integrated amplifier with battery voltage of 1V

Slow start integrated regulated power supply circuit

New version of light cube 8*8*8 clock host computer temperature infrared control: The light cube has been updated. After two months of adjustment, the board circuit design program has been transplanted and changed. The new version of the light cube does not use 74HC573 and 2803 chi...; 黄伟达 51mcu

The smallest stepper drive controller with CAN bus: ◆PANdrive series: controller + driver + motor (stepper, brushless DC) + encoderPANdrive series products are intelligent products that integrate controllers, drivers, motors, magnetic encoders and othe...; trinamic Industrial Control Electronics

Is there a problem with the parity check of the STM32f103Z serial port?: I found that the data transmission is not correct when the serial port is set to odd or even parity. I don't know why? Send 0x01 and receive 0x81...; yewuyi stm32/stm8

Advantages of TI's multi-channel PA controller AMC7932 in MIMO systems: PA controllers are used in base station systems to provide the PA with the required precise gate voltage. The current MIMO system has a large number of channels, and at the same time, each channel has...; qwqwqw2088 Analogue and Mixed Signal

PCB Design Tips for RF Circuits: [size=3]Today, PCB technology mainly changes according to the characteristics and requirements of electronic products. In recent years, electronic products have become more and more multifunctional, s...; ohahaha PCB Design

[Low Power] (Video) Low Power Solutions for Virtex-6 and Spartan-6 FPGA Designs: ...; ddllxxrr FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components

Popular Articles

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Index Files: 294 2774 2035 1213 1932 6 56 41 25 39

Datasheet 0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号京ICP备10001474号-1 电信业务审批[2006]字第258号函

京公网安备 11010802033920号