TL30W01-D(T36)
TOSHIBA LED lamp
TL30W01-D(T36)
○
Surface-mount devices
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4.5 (L) mm × 2.0 (W) mm × 0.8 (H) mm
High luminous flux: 19 lm(typ.)@150 mA
Color: White
Topr / Tstg: -40 to 100°C
Reflow-solderable
Standard embossed tape packing: T36 (1,000 / reel), 4-mm pitch
Applications: LCD backlighting and so on
Unit: mm
Color and Material
Part Number
TL30W01-D(T36)
Color
White
Material
InGaN
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
Junction Temperature
(Note 2)
Symbol
I
F
P
D
T
opr
T
stg
T
j
Rating
180
684
−40
to 100
−40
to 100
140
Unit
mA
mW
°C
°C
°C
JEDEC
JEITA
TOSHIBA
-
-
4-2H1
Weight: 0.02 g (typ.)
Note 1: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease
in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/”Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 2: The junction-to-ambient thermal resistance, Rth(j-a), should be kept below 140°C/W so that the
TL30W01-D(T36) is not exposed to a condition beyond the absolute maximum ratings. Rth(j-a): Thermal
resistance from the LED junction to ambient temperature
(mA)
I
F
-Ta
200
180
160
140
120
100
80
60
40
20
0
0
20
40
60
Rth(j-a) = 140
°C
/W
Allowable forward current
I
F
80
100
120
Ambient temperature
Ta
(°C)
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2008-12-22
TL30W01-D(T36)
Electrical Caracteristics
(Ta = 25°C)
Characteristics
Forward Voltage (Note 3)
Reverse Voltage
Symbol
V
F
V
R
Test condition
I
F
=
150 mA
I
R
=
10 mA
Min.
3.0
⎯
Typ.
⎯
0.75
Max.
3.8
⎯
Unit
V
V
Note 3: V
F
rank classification:
The specification on the below table is used for V
F
classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Please note the delivery ratio of each rank be unquestioned.
Accuracy
±0.05V
Forward Voltage
Part Number
Min
TL30W01-D(T36)
VF2
VF1
Unit
3.0
3.4
3.0
V
Max
3.8
3.8
3.4
mA
150
V
F
I
F
Optical Characteristics
(Ta = 25°C)
Characteristics
Chromaticity
Luminous flux
Symbol
C
x
C
y
F
Test condition
I
F
=150
mA
I
F
=150
mA
I
F
=
150 mA
(Note 5)
Min
Typ.
(Note 4)
(Note 4)
19
(Note 5)
Max
Unit
⎯
⎯
lm
Note 4: Chromaticity classification:
The specification on the below table is used for Cx/Cy classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Please note the delivery ratio of each rank be unquestioned.
Accuracy
±0.01
色度ランク
Chromaticity classification
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
0.27
0.26
0.25
0.24
0.28
0.29
0.30
Cx
0.300
D1
0.300
0.315
Cy
0.330
0.275
0.290
0.350
0.350
0.290
0.305
0.370
D2
D1
D2
0.315
0.315
0.315
0.330
0.330
Cy
0.31
0.32
Cx
0.33
0.34
0.35
0.36
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2008-12-22
TL30W01-D(T36)
Note 5: F rank classification:
The specification on the below table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Accuracy
±10%
Luminous flux
Part Number
Min
TL30W01-D(T36)
F4
F3
F2
Unit
15.1
21.4
18.0
15.1
lm
Max
25.5
25.5
21.4
18.0
mA
150
I
F
F
Package Dimensions
Protection Device
2.
1.
1.Anode
2.Cathode
Precaution for ESD Protection and Applications
•
The product is sensitive to electrostatic and care must be fully taken when handling products. Particularly in the case
that an over-voltage shall be applied, the overflowed energy may cause damage to or possibly result in destruction of
the product. Customer shall take absolutely secure countermeasures against electrostatic and surge when handling
the product.
•
This product is designed for general light source usage and it has applied the measurement standard that matched
with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (e.g. Light source
for sensor, optical communication and etc).
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2008-12-22
TL30W01-D(T36)
Initial Electrical/ Optical Characteristics
F-I
F
100
F – I
F
I
F
-V
F
– V
F
I
F
1000
Ta=25℃
Forward Current I
F
(mA)
順電 流 I
F
(mA)
Ta=25℃
Flux F (lm)
光束 F(lm）
10
100
1
10
0.1
1
10
100
1000
1
2
2.2
2.4
2.6
Forward Current I
F
(mA)
順電流 I
F
（½A)
2.8 3 3.2 3.4 3.6
順電圧 V
F
(V)
Forward Voltage V
F
(V)
3.8
4
色度-IF
Chromaticity – I
F
0.33
波長特性
Spectrum
1
Ta=25℃
IF=150 mA
Ta=25℃
0.8
0.325
Relative
光 度
相 対
Intensity
0.6
0.4
0.2
0
350
Cy
Cy
100½A
150½A
0.32
180½A
5½A
0.315
0.305
20½A
10½A
50½A
0.31
0.315
0.32
400
450
Cx
Cx
550 600 650
波長 λ(nm)
Wavelength
λ
(nm)
500
700
750
800
Radiation Pattern
x
y
x
Ta= 25°C
I
F
=150 mA
Y
y
Relative light intensity
Relative light intensity
相対発光強度
Note 6: Please note that all above graph shown are typical reference data point and not guarantee specifications
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2008-12-22
TL30W01-D(T36)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before
soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 168 hours in an environment of 5°C
to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or
the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or
drop the packed devices.
Mounting Method
Soldering
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Reflow soldering (example)
Temperature profile for Pb soldering (example)
10 s max
(*)
240°C max
Package surface
temperature (°C)
Temperature profile for Pb-free soldering (example)
5 s max
(*)
(*)
Package surface
temperature (°C)
(*)
260°C max
4°C/s max
(*)
max
(*)
150 to 180°C 230°C
4°C/s max
(*)
60 to 120 s max
(*)
30 to 50 s max
(*)
Time
(s)
max
(*)
140 to 160°C
4°C/s max
(*)
4°C/s max
(*)
60 to 120 s max
(*)
Time
(s)
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The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the
above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening
the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
When any soldering corrections are made manually,a hot-plate should be used .
(only once at each soldering point)
Temperature of a hot plate: 150°C
Soldering iron:
25 W
Temperature:
300°C or less
Time:
within 3 s
If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales
representative.
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2008-12-22
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