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ZL30415GGC2

Description
Support Circuit, 1-Func, PBGA64, 8 X 8 MM, 0.80 MM PITCH, LEAD FREE, CABGA-64
CategoryWireless rf/communication    Telecom circuit   
File Size312KB,23 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
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ZL30415GGC2 Overview

Support Circuit, 1-Func, PBGA64, 8 X 8 MM, 0.80 MM PITCH, LEAD FREE, CABGA-64

ZL30415GGC2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionLFBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B64
JESD-609 codee1
length8 mm
Number of functions1
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.41 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
ZL30415
SONET/SDH Clock Multiplier PLL
Data Sheet
Features
Meets jitter requirements of Telcordia GR-253-
CORE for OC-12, OC-3, and OC-1 rates
Meets jitter requirements of ITU-T G.813 for STM-
4, and STM-1 rates
Provides one differential LVPECL output clock
selectable to 19.44 MHz, 38.88 MHz, 77.76 MHz,
155.52 MHz, or 622.08 MHz
Provides a single-ended CMOS output clock at
19.44 MHz
Accepts a single-ended CMOS reference at
19.44 MHz or a differential LVDS, LVPECL, or
CML reference at 19.44 MHz or 77.76 MHz
Provides a LOCK indication
3.3 V supply
Ordering Information
ZL30415GGC
ZL30415GGC2
64 Ball CABGA
64 Ball CABGA*
June 2005
*Pb-free Tin/Silver/Copper
-40°C to +85°C
Description
The ZL30415 is an analog phase-locked loop (APLL)
designed to provide jitter attenuation and rate
conversion for SDH (Synchronous Digital Hierarchy)
and SONET (Synchronous Optical Network)
networking equipment. The ZL30415 generates low
jitter output clocks that meet the jitter requirements of
Telcordia GR-253-CORE OC-12, OC-3, OC-1 rates
and ITU-T G.813 STM-4 and STM-1 rates.
The ZL30415 accepts a CMOS compatible reference
at 19.44 MHz or a differential LVDS, LVPECL, or CML
reference at 19.44 MHz or 77.76 MHz and generates a
differential LVPECL output clock selectable to
19.44 MHz, 38.88 MHz, 77.76 MHz, 155.52 MHz, or
622.08 MHz, and a single-ended CMOS clock at
19.44 MHz. The ZL30415 provides a lock indication.
Applications
SONET/SDH line cards
REF_SEL
LPF
FS3
FS2 FS1
C19o, C38o, C77o,
C155o, C622o,
LVPECL output
C19i
Reference
Selection
MUX
Frequency
& Phase
Detector
Loop
Filter
VCO
REFinP/N
19.44 MHz and 77.76 MHz
State
Machine
Reference
and
Bias Circuit
Frequency
Dividers
and
Clock
Drivers
OC-CLKoP/N
C19o
C19i or C77i
CML, LVDS,
LVPECL input
REF_FREQ
LOCK
BIAS
VCC
GND
VDD
C19oEN
03
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2005, Zarlink Semiconductor Inc. All Rights Reserved.

ZL30415GGC2 Related Products

ZL30415GGC2
Description Support Circuit, 1-Func, PBGA64, 8 X 8 MM, 0.80 MM PITCH, LEAD FREE, CABGA-64
Is it Rohs certified? conform to
Maker Zarlink Semiconductor (Microsemi)
package instruction LFBGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B64
JESD-609 code e1
length 8 mm
Number of functions 1
Number of terminals 64
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code LFBGA
Package shape SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED
Certification status Not Qualified
Maximum seat height 1.41 mm
Nominal supply voltage 3.3 V
surface mount YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal surface TIN SILVER COPPER
Terminal form BALL
Terminal pitch 0.8 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED
width 8 mm

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