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ZL20200/LDG1

Description
RF and Baseband Circuit, 8 X 8 MM, LEAD FREE, QFN-56
CategoryWireless rf/communication    Telecom circuit   
File Size504KB,51 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

ZL20200/LDG1 Overview

RF and Baseband Circuit, 8 X 8 MM, LEAD FREE, QFN-56

ZL20200/LDG1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionVQCCN, LCC56,.31SQ,20
Reach Compliance Codecompliant
JESD-30 codeS-XQCC-N56
JESD-609 codee3
length8 mm
Humidity sensitivity level3
Number of functions1
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeVQCCN
Encapsulate equivalent codeLCC56,.31SQ,20
Package shapeSQUARE
Package formCHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply3 V
Certification statusNot Qualified
Maximum seat height0.9 mm
Maximum slew rate0.17 mA
Nominal supply voltage3 V
surface mountYES
Telecom integrated circuit typesRF AND BASEBAND CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width8 mm
ZL20200
Dual Band IS136/AMPS Transceiver
Data Sheet
Features
Dual Band IS136 (800/1900 MHz) Compatible
Fully Integrated Dual Band Transceiver
Receive - IF to Baseband I and Q
Transmit - Baseband I / Q to RF
Integrated Filters
FM Demodulator
RF and IF Synthesizers
Fully Programmable via serial bus
3 Volt operation
Small scale package
Ordering Information
ZL20200/LDG
ZL20200/LDF
ZL20200/LDG1
ZL20200/LDF1
56 Pin QFN
Trays,
56 Pin QFN
Trays,
56 Pin QFN* Trays,
56 Pin QFN* Trays,
*Pb Free Matte Tin
-40 to +85°C
Bake
Bake
Bake
Bake
&
&
&
&
Drypack
Drypack
Drypack
Drypack
November 2006
Description
The ZL20200 is a fully integrated transceiver for dual
band IS136/AMPS handsets. The IF input to the receive
path is amplified and down-converted to baseband I
and Q signals. Gain control is provided. Baseband
filtering is also included. A FM demodulator is also
provided to support AMPS operation.
The transmit path consists of a quadrature modulator,
gain control at IF and up-conversion to RF. Dual band
RF outputs are provided. The transmit output stages
can be programmed to optimize performance and
current consumption.
Applications
Dual Band (850/PCS1900) TDMA/AMPS Mobile
Telephones
Cellular 850 MHz TDMA/AMPS Mobile
Telephones
PCS1900 TDMA Mobile Telephones
Cellular Telematic Systems
Rx I
IS136
90°
Rx Q
FM
Demod
Rx VHF
PLL
Tx VHF
PLL
UHF
PLL
Serial
Interface
Control
FM
RSSI
LOCK DET
UHF LO O/P
UHF VCO
900 MHz Tx
IQ
Mod
1900 MHz Tx
Tx I
Tx Q
Tx IF Filter
(Opt)
Figure 1 - Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL20200/LDG1 Related Products

ZL20200/LDG1
Description RF and Baseband Circuit, 8 X 8 MM, LEAD FREE, QFN-56
Is it Rohs certified? conform to
Maker Zarlink Semiconductor (Microsemi)
package instruction VQCCN, LCC56,.31SQ,20
Reach Compliance Code compliant
JESD-30 code S-XQCC-N56
JESD-609 code e3
length 8 mm
Humidity sensitivity level 3
Number of functions 1
Number of terminals 56
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material UNSPECIFIED
encapsulated code VQCCN
Encapsulate equivalent code LCC56,.31SQ,20
Package shape SQUARE
Package form CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260
power supply 3 V
Certification status Not Qualified
Maximum seat height 0.9 mm
Maximum slew rate 0.17 mA
Nominal supply voltage 3 V
surface mount YES
Telecom integrated circuit types RF AND BASEBAND CIRCUIT
Temperature level INDUSTRIAL
Terminal surface MATTE TIN
Terminal form NO LEAD
Terminal pitch 0.5 mm
Terminal location QUAD
Maximum time at peak reflow temperature 30
width 8 mm
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