ZL70250UDJ4 datasheet, PDF - EEWORLD Datasheet

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ZL70250UDJ4: DescriptionTelecom Circuit, 1-Func, LEAD FREE, DIE-35; CategoryWireless rf/communication Telecom circuit; File Size448KB，20 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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ZL70250UDJ4 Overview

Telecom Circuit, 1-Func, LEAD FREE, DIE-35

ZL70250UDJ4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	35
Reach Compliance Code	compliant
JESD-30 code	S-XUUC-N35
JESD-609 code	e2
Number of functions	1
Number of terminals	35
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	SQUARE
Package form	UNCASED CHIP
power supply	1.5 V
Certification status	Not Qualified
Nominal supply voltage	1.5 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER
Terminal form	NO LEAD
Terminal location	UPPER

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ZL70250

Ultra Low Power RF Transceiver

Shortform Data Sheet

Features

•

Ultra Low Power

•

Tx & Rx current: <2 mA

Standby current: <500 nA

Supply: 1.2 V to 1.8 V typical

•

Sniff with automatic receive or standby

Automatic Clear-to-Send, Turn-around and

Standby

Receiver AGC

Packetization

Preample & sync

Whitening

Pb-free Solder bumped die - ZL70250UDJ4

QFN-40; 6mm x 6mm (for evaluation only)

Ordering Information

January 2010

Radio Frequency

•

IC range: 795-965 MHz

North American ISM band: 902-928 MHz

European SRD bands: 863-870 MHz

•

Radio Performance

•

Bit rate: up to 186 kbits/s (raw)

Tx power: up to +2 dBm

Rx sensitivity: -90 dBm at full rate

•

Very few external components

•

Only crystal & bias resistor

Applications

•

Battery powered Applications in Body Area

Networks

Applications relying on energy harvesting

Short range communications with very long

battery life

Wireless sensors

Remote controls

Voice communication

•

Standard interfaces

•

SPI data port

2-wire control port

•

MAC

•

Digital RSSI and Blocker Indicator

Clear Channel Assessment

Figure 1 - ZL70250 Typical Applications

Zarlink Semiconductor Inc.

Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

ZL70250

Table of Contents

Shortform Data Sheet

1.0 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.0 Regulatory Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.0 Interface Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1 Control Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.1.2 Bit-level Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2 Data Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.2.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.2.2 SPI Data Packet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.2.3 SPI Functional Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4.2.4 PCM Data Packet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5.0 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.2 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.3 Digital I/O DC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.4 Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6.0 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2 Package Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.2.1 Solder Bumped Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.2.2 QFN-40 (for evaluation only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Zarlink Semiconductor Inc.

ZL70250

1.0

Change Summary

Shortform Data Sheet

Changes from January 2008 Issue to January 2010 Issue.

Page

Item

6.1, “Pinout“

Change

Updated the description for AMX and VDDTEST pins.

2.0

Introduction

The ultra low-power ZL70250 RF transceiver IC (Integrated Circuit) makes RF telemetry possible in applications

where very low power requirements made it unrealistic until now. As illustrated below, end-applications may include

wireless sensors, Body Area Networks - principally on-body sensors - or voice communication.

With a typical current consumption below 2 mA in both transmit (-10 dBm) and receive, and a data rate up to

186 kbit/s, the ZL70250 IC enables bi-directional RF links with an impressive efficiency of 13nJ/bit over a range up

to a couple hundred meters.

The output power is programmable and can be reduced down to -25 dBm to save power in cases where the link

budget allows it or increased up to +2 dBm for more range or to allow for system losses, like a very small antenna

or body tissue absorption.

In order to achieve the minimum possible power consumption, the ZL70250 offers a large number of optimization

parameters, all available to the user via the control interface. To streamline the setup and optimization process,

most parameters have an on-chip automatic trim capability. The frequency tuning is also highly automated.

Despite its very low power consumption, the ZL70250 also includes a highly flexible MAC (Media Access

Controller) that offers all the basic functions needed to implement a link layer with the minimum amount of data

transfer between the ZL70250 and its controller. Some of the capabilities are listed below:

•

Digital RSSI and Blocker Indicator

Clear Channel Assessment

Transmit with automatic Clear to Send

Sniff with automatic receive or standby

Receiver AGC (programmable)

Preamble and Sync

Whitening

Packetization with programmable size for both transmit and receive

Automatic standby after receive

Automatic turn-around for bi-directional data transfer

The ZL70250 is also highly integrated: beside the antenna and, in some cases, its matching network, only a crystal

and a reference resistor are required. Available as a 2 mm x 3 mm bumped die, the IC enables applications with a

very small footprint.

Zarlink Semiconductor Inc.

ZL70250UDJ4 Related Products

	ZL70250UDJ4
Description	Telecom Circuit, 1-Func, LEAD FREE, DIE-35
Is it Rohs certified?	conform to
Maker	Microsemi
Parts packaging code	DIE
package instruction	DIE, DIE OR CHIP
Contacts	35
Reach Compliance Code	compliant
JESD-30 code	S-XUUC-N35
JESD-609 code	e2
Number of functions	1
Number of terminals	35
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	SQUARE
Package form	UNCASED CHIP
power supply	1.5 V
Certification status	Not Qualified
Nominal supply voltage	1.5 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal surface	TIN SILVER
Terminal form	NO LEAD
Terminal location	UPPER

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