ZL70250
Ultra Low Power RF Transceiver
Shortform Data Sheet
Features
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Ultra Low Power
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Tx & Rx current: <2 mA
Standby current: <500 nA
Supply: 1.2 V to 1.8 V typical
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Sniff with automatic receive or standby
Automatic Clear-to-Send, Turn-around and
Standby
Receiver AGC
Packetization
Preample & sync
Whitening
Pb-free Solder bumped die - ZL70250UDJ4
QFN-40; 6mm x 6mm (for evaluation only)
Ordering Information
January 2010
Radio Frequency
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IC range: 795-965 MHz
North American ISM band: 902-928 MHz
European SRD bands: 863-870 MHz
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Radio Performance
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Bit rate: up to 186 kbits/s (raw)
Tx power: up to +2 dBm
Rx sensitivity: -90 dBm at full rate
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Very few external components
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Only crystal & bias resistor
Applications
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Battery powered Applications in Body Area
Networks
Applications relying on energy harvesting
Short range communications with very long
battery life
Wireless sensors
Remote controls
Voice communication
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Standard interfaces
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SPI data port
2-wire control port
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MAC
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Digital RSSI and Blocker Indicator
Clear Channel Assessment
Figure 1 - ZL70250 Typical Applications
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Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2008-2010, Zarlink Semiconductor Inc. All Rights Reserved.
ZL70250
Description
Shortform Data Sheet
The ZL70250 ultra low-power radio frequency (RF) transceiver provides a wireless link in applications where power
consumption is of primary importance. The transceiver’s ultra low-power requirements allows the use of a miniature
button cell battery or energy-harvesting methods, enabling devices with extremely small form factor.
The availability of the transceiver as bumped die combined with the extremely low number of external components
also contributes in minimizing the application footprint.
The ultra low-power IC operates in unlicensed frequency bands between 795 – 965 MHz and offers data rates up to
186 kbps to support voice communication. Duty cycling can be employed for applications that require lower
average payload to further reduce power consumption.
The device includes the RF transceiver as well as a Media Access Controller (MAC) that performs most link support
functions including Received Signal Strength Indication (RSSI), Clear Channel Assessment (CCA), sniff, preamble
& sync, packetization and whitening. The device uses standard interfaces, enabling easy integration with a
standard microcontroller or Digital Signal Processor (DSP).
Figure 2 - Simplified Block Diagram
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Zarlink Semiconductor Inc.
ZL70250
Table of Contents
Shortform Data Sheet
1.0 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.0 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.0 Regulatory Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.0 Interface Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Control Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1.2 Bit-level Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2 Data Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2.1 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2.2 SPI Data Packet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2.3 SPI Functional Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2.4 PCM Data Packet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.0 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3 Digital I/O DC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.4 Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.0 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 Package Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.2.1 Solder Bumped Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.2.2 QFN-40 (for evaluation only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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Zarlink Semiconductor Inc.
ZL70250
List of Figures
Shortform Data Sheet
Figure 1 - ZL70250 Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2 - Simplified Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3 - Bit-level Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4 - SPI Receive Timing, ZL70250 to Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5 - SPI Transmit Timing, Controller to ZL70250 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6 - SPI Data Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 7 - Functional SPI Transmit Timing, Controller to ZL70250 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 8 - Functional SPI Receive Timing, ZL70250 to Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 9 - PCM Data Packet with 32 Bit Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 10 - PCM Start of Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 11 - PCM End of Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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Zarlink Semiconductor Inc.
ZL70250
1.0
Change Summary
Shortform Data Sheet
Changes from January 2008 Issue to January 2010 Issue.
Page
15
Item
6.1, “Pinout“
Change
Updated the description for AMX and VDDTEST pins.
2.0
Introduction
The ultra low-power ZL70250 RF transceiver IC (Integrated Circuit) makes RF telemetry possible in applications
where very low power requirements made it unrealistic until now. As illustrated below, end-applications may include
wireless sensors, Body Area Networks - principally on-body sensors - or voice communication.
With a typical current consumption below 2 mA in both transmit (-10 dBm) and receive, and a data rate up to
186 kbit/s, the ZL70250 IC enables bi-directional RF links with an impressive efficiency of 13nJ/bit over a range up
to a couple hundred meters.
The output power is programmable and can be reduced down to -25 dBm to save power in cases where the link
budget allows it or increased up to +2 dBm for more range or to allow for system losses, like a very small antenna
or body tissue absorption.
In order to achieve the minimum possible power consumption, the ZL70250 offers a large number of optimization
parameters, all available to the user via the control interface. To streamline the setup and optimization process,
most parameters have an on-chip automatic trim capability. The frequency tuning is also highly automated.
Despite its very low power consumption, the ZL70250 also includes a highly flexible MAC (Media Access
Controller) that offers all the basic functions needed to implement a link layer with the minimum amount of data
transfer between the ZL70250 and its controller. Some of the capabilities are listed below:
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Digital RSSI and Blocker Indicator
Clear Channel Assessment
Transmit with automatic Clear to Send
Sniff with automatic receive or standby
Receiver AGC (programmable)
Preamble and Sync
Whitening
Packetization with programmable size for both transmit and receive
Automatic standby after receive
Automatic turn-around for bi-directional data transfer
The ZL70250 is also highly integrated: beside the antenna and, in some cases, its matching network, only a crystal
and a reference resistor are required. Available as a 2 mm x 3 mm bumped die, the IC enables applications with a
very small footprint.
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