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ZL50402GDG

Description
DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,139 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

ZL50402GDG Overview

DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208

ZL50402GDG Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Objectid2056617607
Parts packaging codeBGA
package instructionLBGA,
Contacts208
Reach Compliance Codecompliant
compound_id11503515
JESD-30 codeS-PBGA-B208
JESD-609 codee0
length17 mm
Number of functions1
Number of terminals208
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.4 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
ZL50402
Managed 2FE + 1GE Layer-2
Ethernet Switch
Data Sheet
Zarlink Features
Integrated Single-Chip 10/100/1000 Mbps
Ethernet Switch
• Two 10/100 Mbps auto-negotiating Fast
Ethernet (FE) ports with RMII, MII, GPSI,
Reverse MII & Reverse GPSI interface options
• One 10/100/1000 Mbps auto-negotiating port
with GMII & MII interface options, that can be
used as a WAN uplink or as a 9th port
• a 10/100 Mbps Fast Ethernet (FE) CPU port
with Reverse MII interface option
Embedded 2.0 Mbits (256 KBytes) internal
memory for control databases and frame data
buffer
• Supports jumbo frames up to 4 KBytes
CPU access supports the following interface
options:
• 8/16-bit ISA interface
• Serial interface with MII port; recommended
for light management
• Serial interface in lightly managed mode, or in
unmanaged mode with optional I
2
C EEPROM
interface
Ethernet IEEE 802.3x flow control for full duplex
ports, back pressure flow control for half duplex
ports
8/16-bit
or
Serial
August 2006
Ordering Information
ZL50402GDG
ZL50402GDG2
208-Ball LBGA
208-Ball LBGA**
**Pb Free Tin/Silver/Copper
-40°C to +85°C
Built-in reset logic triggered by system
malfunction
Built-In Self Test for internal SRAM
IEEE-1149.1 (JTAG) test port
L2 Switching
L2 switching
• MAC address self learning, up to 4 K MAC
addresses
• MAC address table supports unicast and
multicast MAC address and IP multicast
address learning
Supports IP Multicast with IGMP snooping, up to
4 K IP Multicast groups
C
P
U
ZL50402
MII
GM II / M II
2-Port 10/100M + 1G
Ethernet Switch
EEPROM
I
2
C
10/100/
1000
PHY
RM II / M II / GPSI
Dual
10/100
PHY
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50402GDG Related Products

ZL50402GDG
Description DATACOM, LAN SWITCHING CIRCUIT, PBGA208, 17 X 17 MM, 1.40 MM HEIGHT, MO-192, LBGA-208
Is it lead-free? Contains lead
Is it Rohs certified? incompatible
Maker Microsemi
Objectid 2056617607
Parts packaging code BGA
package instruction LBGA,
Contacts 208
Reach Compliance Code compliant
compound_id 11503515
JESD-30 code S-PBGA-B208
JESD-609 code e0
length 17 mm
Number of functions 1
Number of terminals 208
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code LBGA
Package shape SQUARE
Package form GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 225
Certification status Not Qualified
Maximum seat height 1.4 mm
Nominal supply voltage 1.8 V
surface mount YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL
Terminal surface TIN LEAD
Terminal form BALL
Terminal pitch 1 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature 30
width 17 mm

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