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ZL50118GAG2

Description
SPECIALTY TELECOM CIRCUIT, PBGA324, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034, BGA-324
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,96 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Environmental Compliance
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ZL50118GAG2 Overview

SPECIALTY TELECOM CIRCUIT, PBGA324, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034, BGA-324

ZL50118GAG2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerXILINX
Parts packaging codeBGA
package instruction,
Contacts324
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B324
JESD-609 codee1
Number of terminals324
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
ZL50115/16/17/18/19/20
32, 64 and 128 Channel CESoP
Processors
Data Sheet
Features
General
Circuit Emulation Services over Packet (CESoP)
transport for MPLS, IP and Ethernet networks
On chip timing & synchronization recovery across
a packet network
On chip dual reference Stratum 4 DPLL (Stratum
3 Holdover accuracy)
Grooming capability for Nx64 Kbps trunking
Fully compatible with Zarlink's ZL50110, ZL50111,
ZL50112 and ZL50114 CESoP processors
Ordering Information
ZL50115GAG
324 Ball PBGA
trays, bake
ZL50116GAG
324 Ball PBGA
trays, bake
ZL50117GAG
324 Ball PBGA
trays, bake
ZL50118GAG
324 Ball PBGA
trays, bake
ZL50119GAG
324 Ball PBGA
trays, bake
ZL50120GAG
324 Ball PBGA
trays, bake
ZL50115GAG2 324 Ball PBGA** trays, bake
ZL50116GAG2 324 Ball PBGA** trays, bake
ZL50117GAG2 324 Ball PBGA** trays, bake
ZL50118GAG2 324 Ball PBGA** trays, bake
ZL50119GAG2 324 Ball PBGA** trays, bake
ZL50120GAG2 324 Ball PBGA** trays, bake
**Pb Free Tin/Silver/Copper
&
&
&
&
&
&
&
&
&
&
&
&
dry
dry
dry
dry
dry
dry
dry
dry
dry
dry
dry
dry
pack
pack
pack
pack
pack
pack
pack
pack
pack
pack
pack
pack
March 2009
-40°C to +85°C
Circuit Emulation Services
Supports ITU-T recommendation Y.1413 and
Y.1453
Supports IETF RFC4553 and RFC5086
Supports MEF8 and MFA 8.0.0
Structured, synchronous CESoP with clock
recovery
Unstructured, asynchronous CESoP, with integral
per stream clock recovery
H.110, H-MVIP, ST-BUS backplane
Up to 128 bi-directional 64 Kbps channels
Direct connection to LIUs, framers, backplanes
Customer Side Packet Interfaces
• 100 Mbps MII Fast Ethernet (ZL50118/19/20 only)
(may also be used as a second provider side packet
interface)
Provider Side Packet Interfaces
100 Mbps MII Fast Ethernet or 1000 Mbps
GMII/TBI Gigabit Ethernet
Customer Side TDM Interfaces
Up to 4 T1/E1, 1 J2 or 1 T3/E3 ports
H.110, H-MVIP, ST-BUS backplanes
4 T1/E1 or 1 J2/T3/E3 ports
( L I U , F r a m e r , B a c k p la n e )
Dual
P acket
In te rfa c e
MAC
( M II , G M I I , T B I )
100 Mbps MII Fast Ethernet
TDM
In te rfa c e
M u lt i- P r o t o c o l
P acket
P r o c e s s in g
E n g in e
PW , RTP, UDP,
IP v 4 , IP v 6 , M P L S ,
E C ID , V L A N , U s e r
D e f in e d , O t h e r s
P e r P o rt D C O fo r
C lo c k R e c o v e r y
100 Mbps MII
Fast Ethernet
O n C h ip P a c k e t M e m o r y
( J it t e r B u f f e r C o m p e n s a t io n f o r 1 2 8 m s o f P a c k e t D e la y V a r ia t io n )
D u a l R e fe re n c e
DPLL
H o s t P ro c e s s o r
In te r fa c e
JT A G
Backplane
Clocks
3 2 - b it M o t o r o la c o m p a t ib le P Q I I ®
Figure 1 - ZL50115/16/17/18/19/20 High Level Overview
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2009, Zarlink Semiconductor Inc. All Rights Reserved.
1000 Mbps GMII/TBI Gigabit Ethernet
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