Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28
| Parameter Name | Attribute value |
| Maker | Winbond Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| JESD-30 code | R-PDIP-T28 |
| length | 35.26 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 4.45 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |

| W24256AK-15 | W24256AS-15 | W24256AQ-15 | W24256AK-35 | W24256AS-35 | W24256AQ-35 | W24256AJ-35 | W24256AJ-15 | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 0.330 INCH, SOP-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, SOP-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 |
| Maker | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation | Winbond Electronics Corporation |
| Parts packaging code | DIP | SOIC | TSOP | DIP | SOIC | TSOP | SOJ | SOJ |
| package instruction | DIP, | SOP, | TSOP1, | 0.300 INCH, SKINNY, PLASTIC, DIP-28 | SOP, | TSOP1, | 0.300 INCH, SOJ-28 | SOJ, |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | unknown | unknown | not_compliant | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 15 ns | 15 ns | 15 ns | 35 ns | 35 ns | 35 ns | 35 ns | 15 ns |
| JESD-30 code | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 |
| length | 35.26 mm | 18.11 mm | 11.8 mm | 35.26 mm | 18.11 mm | 11.8 mm | 18.03 mm | 18.03 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | TSOP1 | DIP | SOP | TSOP1 | SOJ | SOJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.45 mm | 2.85 mm | 1.2 mm | 4.45 mm | 2.85 mm | 1.2 mm | 3.56 mm | 3.56 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 0.55 mm | 2.54 mm | 1.27 mm | 0.55 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 8.41 mm | 8 mm | 7.62 mm | 8.41 mm | 8 mm | 7.62 mm | 7.62 mm |
| JESD-609 code | - | e3 | e3 | e0 | e3 | e3 | e0 | - |
| Terminal surface | - | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | - |