Metal Film Chip Resistors
Metal Film Chip Resistors
0603, 0805
Type:
ERA 3Y, 6Y
■
Features
●
Small size and lightweight
●
High reliability
Low T.C.R. & current noise, excellent non-linearity
●
Suitable for both reflow and flow soldering
●
Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2133A
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
R
A
3
Y
E
B
1
0
2
V
Product Code
Metal Film
Chip Resistors
Size, Power Rating
Type: inches Power Rating
0.1 W
3Y : 0603
0.125 W
6Y : 0805
Temperature Coefficient
T.C.R.
Code
–6
±25
10 /°C (ppm/°C)
E
±50
10
–6
/°C (ppm/°C)
H
±100
10
–6
/°C (ppm/°C)
K
Resistance Tolerance
Code
Tolerance
B
±0.1
%
D
±0.5
%
Code
V
Packaging Methods
Packaging
Punched Carrier Taping
4 mm pitch
Type
ERA3Y
ERA6Y
Resistance Value
The first two digits are significant figures of resistance
and the third one denotes number of zeros following.
■
Construction
Protective coating
■
Dimensions in mm (not to scale)
L
a
Electrode (Inner)
W
Alumina substrate
t
b
Electrode
(Between)
Type
(inches)
High reliability
metal film
Electrode (Outer)
ERA3Y
(0603)
ERA6Y
(0805)
Dimensions (mm)
L
1.60
2.00
±0.20
W
0.80
1.25
±0.20
a
0.30
0.40
±0.20
b
0.30
±0.20
t
0.45
±0.10
Mass (Weight)
[g/1000 pcs.]
2
4
±0.20
±0.10
±0.25
0.40
±0.25
0.50
±0.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aug. 2008
Metal Film Chip Resistors
■
Ratings
Type
(inches)
Limiting Element Maximum Overload Resistance
Power Rating
(2)
Voltage (Maximum
Voltage
Tolerance
at 70 °C (W)
(1)
RCWV) (V)
(V)
(%)
±0.5
±0.1
ERA6Y
(0805)
Resistance
(3)
Range
( )
10
100
36 k
100
10
100
110 k
100
to
91 (E24)
to 33 k (E24)
to 330 k (E24)
to 33 k (E24)
to
91 (E24)
to 100 k (E24)
to 1 M (E24)
to 100 k (E24)
ERA3Y
(0603)
0.1
75
150
0.125
100
200
±0.5
±0.1
T.C.R. Category Temperature
[ 10
–6
/°C Range (Operating
Temperature Range)
(ppm/°C)]
(°C)
± 50
± 25
±100
± 25
–55 to +125
± 50
± 25
±100
± 25
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Rated Power
Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5
Power Rating or max. Overload Voltage listed above
whichever less.
(3) E96 series resistance values are also available. Please contact us for details. Part Number of E96 series is shown ERA3E. , ERA6E.
–55
°C
100
Rated Load (%)
80
60
40
20
0
–60 –40 –20
0
20
40
60
125
°C
80 100 120 140 160 180
70
°C
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
Ambient Temperature (°C)
■
Packaging Methods (Taping)
●
Standard Quantity
Type
ERA3Y
ERA6Y
Kind of Taping
Punched Carrier Taping
Pitch (P
1
)
4 mm
Quantity
5000 pcs./reel
●
Punched Carrier Taping
●
Taping Reel
T
Sprocket hole
φD
0
A
B
Compartment
E
φC
φB
φA
W
T
Chip component
P
1
P
2
P
0
Tape running direction
F
W
Dimensions
(mm)
Type
A
B
W
F
E
±0.10
±0.10
3Y
1.10
1.90
8.00
±0.20
3.50
±0.05
1.75
±0.10
±0.15
6Y
1.65
2.50
±0.20
Type
P
1
P
2
P
0
T
φD
0
3Y
0.70
±0.05
4.00
±0.10
2.00
±0.05
4.00
±0.10
1.50
+0.10
–0
6Y
0.84
±0.05
Dimensions
(mm)
Type
3Y
6Y
Type
3Y
6Y
φA
180.0
–3.0
+0
φB
60 min.
φC
13.0
±1.0
Dimensions
(mm)
Dimensions
(mm)
W
9.0
±1.0
T
11.4
±1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Aug. 2008
Metal Film Chip Resistors
■
Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to properly control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Chip Resistor
Type
(inches)
ERA3Y
(0603)
ERA6Y
(0805)
a
Dimensions (mm)
b
2 to 2.2
3.2 to 3.8
c
0.8 to 1
0.7 to 0.9
1 to 1.4
a
b
c
0.9 to 1.4
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
●
Recommended soldering conditions for flow
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Preheating
Soldering
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Keep the rated power and ambient temperature within the specified derating curve.
* When positioning and mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the
effect of heat generated through close contact between the resistors and neighboring components and for the
temperature rise of adjacent heat-generating components.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
When applying pulses to the resistors, keep the pulse peak within the rated voltage.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be
impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during
handling of the boards with the resistors mounted.
7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
– ER3 –
Embedded System
京公网安备 11010802033920号
EEWORLD
