EEWORLDEEWORLDEEWORLD

Part Number

Search

MT92220BG2

Description
ATM NETWORK INTERFACE, PBGA608, 31 X 31 MM, 2.50 MM HEIGHT, LEAD FREE, MS-034, EPBGA-608
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,209 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

MT92220BG2 Overview

ATM NETWORK INTERFACE, PBGA608, 31 X 31 MM, 2.50 MM HEIGHT, LEAD FREE, MS-034, EPBGA-608

MT92220BG2 Parametric

Parameter NameAttribute value
MakerMicrosemi
Objectid1597182380
Parts packaging codeBGA
package instructionHBGA,
Contacts608
Reach Compliance Codeunknown
compound_id11503690
JESD-30 codeS-PBGA-B608
JESD-609 codee1
length31 mm
Number of functions1
Number of terminals608
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Certification statusNot Qualified
Maximum seat height2.5 mm
Nominal supply voltage2.5 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH NETWORK INTERFACE
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width31 mm
MT92220
1023 Channel Voice Over IP/AAL2
Processor
Data Sheet
Features
1023 full-duplex PCM or ADPCM voice channels
over IP/UDP/RTP connections or over AAL2 VCs
Simultaneously support of IP/UDP connection
and AAL2 VC
RTP packaging optional in IP/UDP connection
Supports IP version 4 and version 6
Supports IP over Ethernet, ATM (AAL5) or POS
Support Ethernet II, IEEE 802.3, LLC/SNAP and
PPP frames
Supports Classical IP over ATM and LAN
Emulation (LANE) v1/v2
Supports MPLS, MPOA and IEEE 802.1p/Q
ELAN-ID
Packages voice in AAL2 according to I.363.2 and
I.366.2
H.110 compliant TDM bus carrying PCM,
ADPCM or HDLC channels
HDLC channels can be used to carry UDP
payload or AAL2 CPS-packet generated by
external agent
Ordering Information
MT92220BG
608 EPBGA Trays, Bake & Drypack
MT92220BG2 608 EPBGA* Trays, Bake & Drypack
*Pb Free Tin/Silver/Copper
May 2007
-40°C to +85°C
Support trunking in RTP and AAL2; up to 255
PCM/ADPCM channels per RTP connection or
AAL2 CID
Support maximum 1500 bytes packet size
Up to 4096 bytes of jitter buffer, absorbing +/- 256
ms of PDV
Less than 250 usec of latency
Injection of CPU-generated RTP or AAL2 CPS-
packets
Reception of CPU-destinated RTP or AAL2 CPS-
packets
Primary and secondary network interfaces
Primary network interface supports 10/100 MII,
POS-PHY or Utopia level 1/2
(8K to16.384M PLL)
MT9043
MT9041
optional
Intel/Motorola
CPU
MT92220
Message Channel
H100
H.110
Signals
Compatibility Clocks
and Frame
Pad
H100/
H110
Interface
Clock
Recovery
uP
Interface
Second
Network
Interface
Primary
Network
Interface
UTOPIA Port B
(PHY/SAR)
MII, POS, or
UTOPIA (PHY/SAR)
interface
Service Timer
SS
RTP/AAL2
Assembly
RTP/AAL2
Disassembly
TDM
DataPath
SS/Padding
Calculator
Packet
Identification
and Routing
Dual Memory Controler
Network
Memory
Controler
SSRAM
(256k x18*)
Memory Bank A
SSRAM
(512k x18*)
Memory Bank B
SSRAM
(256k x36*)
SDRAM
(4M x32*)
Memory Bank C
*Typical RAM size for the support of 1023 channels. Parity bis are optionnal on all memories.
Figure 1 - MT92220 Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2002-2007, Zarlink Semiconductor Inc. All Rights Reserved.

MT92220BG2 Related Products

MT92220BG2 MT92220BG
Description ATM NETWORK INTERFACE, PBGA608, 31 X 31 MM, 2.50 MM HEIGHT, LEAD FREE, MS-034, EPBGA-608 ATM NETWORK INTERFACE, PBGA608, 31 X 31 MM, 2.50 MM HEIGHT, MS-034, EPBGA-608
Maker Microsemi Microsemi
Parts packaging code BGA BGA
package instruction HBGA, HBGA,
Contacts 608 608
Reach Compliance Code unknown unknown
JESD-30 code S-PBGA-B608 S-PBGA-B608
length 31 mm 31 mm
Number of functions 1 1
Number of terminals 608 608
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HBGA HBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Certification status Not Qualified Not Qualified
Maximum seat height 2.5 mm 2.5 mm
Nominal supply voltage 2.5 V 2.5 V
surface mount YES YES
Telecom integrated circuit types ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
width 31 mm 31 mm

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 605  723  2224  2072  438  13  15  45  42  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号