R6522AP datasheet, PDF - EEWORLD Datasheet

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R6522AP: DescriptionParallel I/O Port, 16 I/O, CMOS, PDIP40, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，22 Pages; ManufacturerRockwell Automation

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R6522AP Overview

Parallel I/O Port, 16 I/O, CMOS, PDIP40, DIP-40

R6522AP Parametric

Parameter Name	Attribute value
Maker	Rockwell Automation
package instruction	DIP-40
Reach Compliance Code	compliant
ECCN code	EAR99
JESD-30 code	R-PDIP-T40
length	51.8 mm
Number of I/O lines	16
Number of ports	2
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	6.1 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE

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R6522AP Related Products

	R6522AP	R6522APE	R6522P	R6522ACE	R6522CE	R6522AC	R6522C
Description	Parallel I/O Port, 16 I/O, CMOS, PDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, PDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, PDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40	Parallel I/O Port, 16 I/O, CMOS, CDIP40, DIP-40
Maker	Rockwell Automation	Rockwell Automation	Rockwell Automation	Rockwell Automation	Rockwell Automation	Rockwell Automation	Rockwell Automation
package instruction	DIP-40	DIP-40	DIP-40	DIP-40	DIP-40	DIP-40	DIP-40
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDIP-T40	R-PDIP-T40	R-PDIP-T40	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40
length	51.8 mm	51.8 mm	51.8 mm	50.8 mm	50.8 mm	50.8 mm	50.8 mm
Number of I/O lines	16	16	16	16	16	16	16
Number of ports	2	2	2	2	2	2	2
Number of terminals	40	40	40	40	40	40	40
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	WDIP	WDIP	WDIP	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW
Maximum seat height	6.1 mm	6.1 mm	6.1 mm	4.19 mm	4.19 mm	4.19 mm	4.19 mm
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE

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