Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(3 Array Type)
Type:
EFOS
Type:
EFOB
Type:
EFOSS
Type:
EFOSM
Type:
EFOBM
Type:
EFOJM
●
Encased in a ceramic package
●
High reliability against soldering heat and mechanical
stress
●
Moisture-proof sealing
●
1.2 mm maximum (SS/SM/BM/JM),
●
Designed for reflow soldering
●
Flat-bottom plate for better mountings
●
Simplifies oscillation circuits by reducing the number
of circuit parts
●
RoHS compliant
■
Features
■
Recommended Applications
●
Clock generator for microprocessors
●
Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
■
Handling Precautions
(See Page 175 to 176)
■
Packaging Specifications
See Page 169 to 177
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
3
5
8
4
Design No.
Packaging Style
B Bulk Pack
Embossed
E
Taping
Frequency
Tolerance
±1.0
%
0
±0.3
%
3
±0.5
%
5
Product Code
Ceramic
EFO
Resonators
Type
Built-In Capacitors
Type with 3-terminals
2 to 13 MHz
S
13.1 to 20 MHz
B
Nominal Oscillation
Frequency
3584
3.58 MHz
1695 16.93 MHz
(Example)
1
2
3
4
5
6
7
8
9
10
11
12
E
F
Product Code
Ceramic
EFO
Resonators
O
Type
Built-In Capacitors
Type with 3-terminals
4 to 13 MHz
SS
4 to 13 MHz
SM
12 to 20 MHz
BM
16 to 20 MHz
JM
30 to 50 MHz
4
0
0
4
Design No.
Packaging Style
B Bulk Pack
Embossed
E
Taping
Frequency
Tolerance
±1.0
%
0
±0.3
%
3
±0.5
%
5
Nominal Oscillation
Frequency
4004
4.00 MHz
1695 16.93 MHz
2005 20.00 MHz
4005 40.00 MHz
(Example)
Part Number
EFOS
EFOB
EFOSS
EFOSM
EFOBM
EFOJM
Frequency range
(MHz)
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
Frequency Temperature Characteristics
(–20 to +80 °C)
±0.2 %
±1.0 %
±0.5 %
±0.2 %
±0.3 %
±0.2 %
±1.0 %
±0.3 %
±0.5 %
±0.2 %
Built-in Capacitors
(Reference)
33 pF
33 pF
21 pF
33 pF
18 pF
10 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Feb. 2009
– EC166 –
Ceramic Resonators, Chip Type
■
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOS]·····2.0
to 13.0 MHz
Oscillating Frequency
Serial No.
1.60±0.20
[Type EFOS, EFOSM]
2.5
2.5
(7.30)
Terminal
Electrodes
7.80
+0.50
–0.20
6-(1.30)
(2.70)
4.2
3.20
+0.30
–0.20
3-0.9 to 1.2
6–R(0.20)
6-(1.00)
2.50±0.20
2.50±0.20
[Type EFOSM]·····4.0
to 13.0 MHz
Oscillating Frequency
Serial No.
Terminal
Electrodes
(7.30)
1.20 max.
(2.70)
3.20
–0.20
+0.30
7.80
–0.20
+0.50
6–R(0.20)
3–(1.00)
2.50±0.20
2.50±0.20
[Type EFOSS]·····4.0
to 13.0 MHz
Oscillating Frequency
Serial No.
1.20 max.
[Type EFOSS]
1.5
1.5
Terminal
Electrodes
(0.15)
4.50±0.20
1.6
2.00±0.30
3-0.55
3–(0.55)
2–1.50±0.20
6–(0.60)
3-0.8
[Type EFOB]·····13.1
to 20.0 MHz
Oscillating Frequency
Serial No.
1.60±0.20
[Type EFOB]
1.9
(2.70)
1.9
(5.00)
Terminal
Electrodes
6–(1.20)
5.50
–0.20
+0.50
3.20
–0.15
6–R(0.20)
6–(1.20)
+0.25
3-1.2
1.90±0.20
1.90±0.20
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
4.2
2.6
(1.60)
01 Feb. 2009
– EC167 –
Ceramic Resonators, Chip Type
■
Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOBM]·····12.0
to 20.0 MHz
Oscillating Frequency
Serial No.
1.20 max.
[Type EFOBM]
1.351.35
4.10±0.20
6–R(0.20)
3–(0.80)
2–1.35±0.20
2.90±0.30
3-0.8
[Type EFOJM]·····16.0
to 20.0, 30.0 to 50.0 MHz
Oscillating Frequency
Serial No.
1.20 max.
[Type EFOJM]
1.6 1.6
(3.10)
3.60
–0.20
+0.30
4.40
+0.50
–0.20
6–R(0.20)
3–(0.80)
2–1.60±0.20
3-0.7 to 1.0
■
Test Circuits Diagram
For Oscillation Circuit
+5 V
IC
14 13
1 2 3
1M
11
4
5
9
7
IN
V1
+5 V
IC
14 13
1 2 3
1M
G=20 log (V0/ V1)
OUT
FET probe
V0
10 M min.
2 pF max.
Ceramic Resonator
11
4
5
9
7
For Loop Gain
0.01
Frequency
2.00 to 8.39 MHz
4.6
Terminal
Electrodes
(3.90)
3.9
Terminal
Electrodes
(3.70)
(2.40)
IC
µPD4069UBC,
TC4069UBP
or similar
µPD74HCU,
TC74 HCU04AP
or similar
Frequency Counter
T.G.
Output
=–20dBm
Ceramic Resonator
8.40 to 50.0 MHz
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Feb. 2009
– EC168 –
Ceramic Resonators, Chip Type
■
Typical Characteristics ····· Temperature Characteristics
Type EFOS
Type EFOB
Type EFOSS
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
4.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
Type
EFOSM
Type
EFOBM
Type
EFOJM
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
2.0 to 8.39 MHz
8.4 to 13 MHz
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–20 0 20 40 60 80
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
–0.2
–0.4
–0.6
–0.8
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
Oscillation Frequency Drift(%)
30 to 50 MHz
16 to 20 MHz
–20 0 20 40 60 80
Temperature (°C)
■
Packaging Specifications
●
Standard Packing Quantity
Type
EFOS, EFOSM
EFOSS
EFOB , EFOBM, EFOJM
Embossed Taping
2500 pcs./reel
2000 pcs./reel
1000 pcs./reel
500 pcs./bag
Bulk
●
Dimensions for Reel in mm (not to scale)
T
[Type EFOS, EFOSM]
Dim.
(mm)
φA
330±5
W
16.4
+2.0
0
φB
80 min.
T
22.4 max.
C
13.0±0.5
t
3 max.
D
21.0±0.8
r
1.0
E
2.0±0.5
E
C
φ
B
Dim.
(mm)
r
D
[Type EFOSS, EFOB, EFOBM, EFOJM]
Dim.
(mm)
φA
180±5
W
12.4
+2.0
0
φB
60 min.
T
18.4 max.
C
13.0±0.5
t
3 max.
D
21.0±0.8
r
1.0
E
2.0±0.5
φ
A
W
t
Dim.
(mm)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Feb. 2009
– EC169 –
Ceramic Resonators, Chip Type
[Type EFOS, EFOSM]
t
1
Feeding hole
φD
0
Chip pocket
F E
3.20
[Type EFOSS]
t
1
Feeding hole
P
0
φD
0
Chip pocket
P
2
F E
W
2.00
4.50
E
P
1
t
2
01 Feb. 2009
B
W
7.80
A
t
2
P
1
P
0
P
2
B
A
Tape running
direction
P
1
Tape running direction
Chip Componen
t
2
Chip Component
Dim.
(mm)
Dim.
(mm)
A
3.7±0.2
P
2
2.0±0.1
B
W
F
E
P
1
8.3±0.2 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
P
0
4.0±0.1
φD
0
1.5
+0.1
0
t
1
0.3
t
2
3.5 max.
Dim.
(mm)
Dim.
(mm)
A
2.6±0.2
P
2
2.0±0.1
B
W
F
5.1±0.2 12.0±0.3 5.5±0.1 1.75±0.10 4.0±0.1
P
0
4.0±0.1
φD
0
1.5
+0.1
0
t
1
0.6 max. 3.0 max.
[Type EFOB, EFOBM, EFOJM]
Feeding hole
t
1
φD
0
Chip pocket
3.60
F E
W
A
t
2
P
1
P
2
P
0
Type EFOJM
(Example)
Tape running direction
W
F
E
P
1
Chip Component
A
1
P
2
2.0±0.1
Dim. (mm)
B
2
P
0
4.0±0.1
Dim.
(mm)
Dim.
(mm)
12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
φD
0
1.5
+0.1
0
t
1
t
2
0.6 max. 3.0 max.
A
1
B
2
6.0±0.2
4.6±0.2
4.9±0.2
Type EFOB
Type EFOBM
Type EFOJM
3.7±0.2
3.4±0.2
4.1±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
4.40
B
– EC170 –
Embedded System
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