Fast Page DRAM Module, 32MX32, 70ns, CMOS, PSMA72,
| Parameter Name | Attribute value |
| Maker | White Electronic Designs Corporation |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N72 |
| memory density | 1073741824 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 32 |
| Number of terminals | 72 |
| word count | 33554432 words |
| character code | 32000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32MX32 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SSIM72 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum standby current | 0.064 A |
| Maximum slew rate | 2.5 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | SINGLE |
| EDI4F3232F7M | EDI4F3232G6M | EDI4F3232G7M | EDI4F3632F6M | EDI4F3632G7M | EDI4F3232F6M | EDI4F3632F7M | EDI4F3632G6M | |
|---|---|---|---|---|---|---|---|---|
| Description | Fast Page DRAM Module, 32MX32, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX32, 60ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX32, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX36, 60ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX36, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX32, 60ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX36, 70ns, CMOS, PSMA72, | Fast Page DRAM Module, 32MX36, 60ns, CMOS, PSMA72, |
| Maker | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 70 ns | 60 ns | 70 ns | 60 ns | 70 ns | 60 ns | 70 ns | 60 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| memory density | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1207959552 bit | 1207959552 bit | 1073741824 bit | 1207959552 bit | 1207959552 bit |
| Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| memory width | 32 | 32 | 32 | 36 | 36 | 32 | 36 | 36 |
| Number of terminals | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| word count | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
| character code | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32MX32 | 32MX32 | 32MX32 | 32MX36 | 32MX36 | 32MX32 | 32MX36 | 32MX36 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| Encapsulate equivalent code | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| Maximum standby current | 0.064 A | 0.064 A | 0.064 A | 0.072 A | 0.072 A | 0.064 A | 0.072 A | 0.072 A |
| Maximum slew rate | 2.5 mA | 2.8 mA | 2.5 mA | 3.052 mA | 2.7 mA | 2.8 mA | 2.7 mA | 3.052 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |