MT9JSF25672PIZ-1G1XX datasheet, PDF

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MT9JSF25672PIZ-1G1XX: DescriptionDDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240; Categorystorage storage; File Size358KB，18 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT9JSF25672PIZ-1G1XX Overview

DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240

MT9JSF25672PIZ-1G1XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
length	133.35 mm
memory density	19327352832 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Maximum seat height	4 mm
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	GOLD
Terminal form	NO LEAD
Terminal location	DUAL
width	30.175 mm

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1GB, 2GB (x72, ECC, SR) 240-Pin Halogen-Free DDR3 RDIMM

Features

DDR3 SDRAM RDIMM

MT9JSF12872PZ – 1GB

MT9JSF25672PZ – 2GB

Features

•

DDR3 functionality and operations supported as

defined in the component data sheet

•

240-pin, registered dual in-line memory module

(RDIMM)

•

Fast data transfer rates: PC3-10600, PC3-8500, or

PC3-6400

•

1GB (128 Meg x 72), 2GB (256 Meg x 72)

•

= 1.5V ±0.075V

•

DDSPD

= +3.0V to +3.6V

•

Supports ECC error detection and correction

•

Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

•

Single rank

•

On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

•

8 internal device banks

•

Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

•

Gold edge contacts

•

Halogen-free

•

Fly-by topology

•

Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

RCD

Figure 1: 240-Pin RDIMM (MO-269 R/C A)

Module height: 30.0mm (1.18in)

Options

•

Operating

–

Commercial (0°C

≤

+70°C)

–

Industrial (–40°C

≤

+85°C)

•

Package

–

240-pin DIMM (halogen-free)

•

Frequency/CAS latency

–

1.25ns @ CL = 11 (DDR3-1600)

–

1.5ns @ CL = 9 (DDR3-1333)

–

1.87ns @ CL = 7 (DDR3-1066)

–

1.87ns @ CL = 8 (DDR3-1066)

–

2.5ns @ CL = 5 (DDR3-800)

–

2.5ns @ CL = 6 (DDR3-800)

Notes:

temperature

Marking

None

-1G6

-1G4

-1G1

-1G0

-80C

-80B

1. Contact Micron for industrial temperature

module offerings.

2. Not recommended for new designs.

(ns)

13.125

(ns)

13.125

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef83b4fcd7

jsf9c128_256x72pz.pdf – Rev. C 1/11

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT9JSF25672PIZ-1G1XX Related Products

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Description	DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240	DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240	DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, DIMM-240
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM,	HALOGEN FREE, MO-269, DIMM-240	HALOGEN FREE, MO-269, DIMM-240	HALOGEN FREE, MO-269, DIMM-240	HALOGEN FREE, MO-269, DIMM-240	HALOGEN FREE, MO-269, DIMM-240
Contacts	240	240	240	240	240	240
Reach Compliance Code	compliant	compliant	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Other features	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH	AUTO REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
JESD-609 code	e4	e4	e4	e4	e4	e4
length	133.35 mm	133.35 mm	133.35 mm	133.35 mm	133.35 mm	133.35 mm
memory density	19327352832 bit	9663676416 bit	19327352832 bit	9663676416 bit	9663676416 bit	19327352832 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	240	240	240	240	240	240
word count	268435456 words	134217728 words	268435456 words	134217728 words	134217728 words	268435456 words
character code	256000000	128000000	256000000	128000000	128000000	256000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256MX72	128MX72	256MX72	128MX72	128MX72	256MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4 mm	4 mm	4 mm	4 mm	4 mm	4 mm
Maximum supply voltage (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	GOLD	GOLD	GOLD	GOLD	GOLD	GOLD
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	30.175 mm	30.175 mm	30.175 mm	30.175 mm	30.175 mm	30.175 mm

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