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APT6013LLLG

Description
Power Field-Effect Transistor, 43A I(D), 600V, 0.13ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size203KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance  
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APT6013LLLG Overview

Power Field-Effect Transistor, 43A I(D), 600V, 0.13ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN

APT6013LLLG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeTO-264AA
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codecompliant
Avalanche Energy Efficiency Rating (Eas)2500 mJ
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage600 V
Maximum drain current (ID)43 A
Maximum drain-source on-resistance0.13 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-264AA
JESD-30 codeR-PSFM-T3
JESD-609 codee1
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)172 A
Certification statusNot Qualified
surface mountNO
Terminal surfaceTIN SILVER COPPER
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON

APT6013LLLG Preview

600V 43A
APT6013B2LL
APT6013LLL
B2LL
0.130
POWER MOS 7
®
R
MOSFET
Power MOS 7 is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
®
losses are addressed with Power MOS 7 by significantly lowering R
DS(ON)
®
and Q
g
. Power MOS 7 combines lower conduction and switching losses
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
• Lower Input Capacitance
• Lower Miller Capacitance
• Lower Gate Charge, Qg
MAXIMUM RATINGS
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
T
J
,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
C
= 25°C
Pulsed Drain Current
1
T-MAX™
TO-264
LLL
• Increased Power Dissipation
• Easier To Drive
• Popular
T-MAX™
or TO-264 Package
D
G
S
All Ratings: T
C
= 25°C unless otherwise specified.
APT6013B2LL_LLL
UNIT
Volts
Amps
600
43
172
±30
±40
565
4.52
-55 to 150
300
43
50
4
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
C
= 25°C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
1
Volts
Watts
W/°C
°C
Amps
mJ
(Repetitive and Non-Repetitive)
1
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
2500
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
DSS
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250µA)
Drain-Source On-State Resistance
2
MIN
TYP
MAX
UNIT
Volts
600
0.130
100
500
±100
3
5
(V
GS
= 10V, I
D
= 21.5A)
Ohms
µA
nA
Volts
9-2004
050-7053 Rev C
Zero Gate Voltage Drain Current (V
DS
= 600V, V
GS
= 0V)
Zero Gate Voltage Drain Current (V
DS
= 480V, V
GS
= 0V, T
C
= 125°C)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 2.5mA)
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
DYNAMIC CHARACTERISTICS
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
on
E
off
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
APT6013B2LL_LLL
Test Conditions
V
GS
= 0V
V
DS
= 25V
f = 1 MHz
V
GS
= 10V
V
DD
= 300V
I
D
= 43A @ 25°C
RESISTIVE SWITCHING
V
GS
= 15V
V
DD
= 300V
I
D
= 43A @ 25°C
R
G
= 0.6Ω
6
INDUCTIVE SWITCHING @ 25°C
V
DD
= 400V, V
GS
= 15V
I
D
= 43A, R
G
= 5Ω
6
INDUCTIVE SWITCHING @ 125°C
V
DD
= 400V, V
GS
= 15V
I
D
= 43A, R
G
= 5Ω
MIN
TYP
MAX
UNIT
5630
1060
70
130
25
40
11
14
27
8
635
585
1030
695
MIN
TYP
MAX
UNIT
Amps
Volts
ns
µC
nC
pF
Gate-Source Charge
Gate-Drain ("Miller ") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Switching Energy
Turn-off Switching Energy
Turn-on Switching Energy
Turn-off Switching Energy
ns
µ
J
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
S
I
SM
V
SD
t
rr
Q
rr
dv
/
dt
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
Pulsed Source Current
Diode Forward Voltage
1
2
43
172
1.3
700
14.7
8
MIN
TYP
MAX
(Body Diode)
(V
GS
= 0V, I
S
= -43
A
)
Reverse Recovery Time (I
S
= -43
A
, dl
S
/dt = 100A/µs)
Reverse Recovery Charge (I
S
= -43
A
, dl
S
/dt = 100A/µs)
Peak Diode Recovery
dv
/
dt
5
V/ns
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
Characteristic
Junction to Case
Junction to Ambient
UNIT
°C/W
0.22
40
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
4 Starting T
j
= +25°C, L = 2.70mH, R
G
= 25Ω, Peak I
L
= 43A
5
dv
/
dt
numbers reflect the limitations of the test circuit rather than the
device itself.
IS
-
ID
43A
di
/
dt
700A/µs
VR
600V
TJ
150
°
C
6 Eon includes diode reverse recovery. See figures 18, 20.
APT Reserves the right to change, without notice, the specifications and inforation contained herein.
0.25
Z
JC
, THERMAL IMPEDANCE (°C/W)
θ
0.20
0.9
0.15
0.7
0.5
0.10
0.3
0.05
0.1
0.05
10
-5
10
-4
SINGLE PULSE
9-2004
Note:
PDM
t1
t2
Duty Factor D = t1/t
2
Peak TJ = PDM x Z
θJC
+ TC
050-7053 Rev C
0
10
-3
10
-2
10
-1
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
1
Typical Performance Curves
I
D
, DRAIN CURRENT (AMPERES)
Junction
temp. (°C)
RC MODEL
120
100
80
60
40
APT6013B2LL_LLL
VGS =15 &10V
8V
0.014
0.006F
7V
Power
(watts)
0.076
0.019F
6.5V
0.13
Case temperature. (°C)
0.278F
6V
20
0
5.5V
5V
R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE
FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL
160
I
D
, DRAIN CURRENT (AMPERES)
0
5
10
15
20
25
30
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
1.2
V
140
120
100
80
60
40
20
0
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST
@ <0.5 % DUTY CYCLE
1.15
1.10
1.05
1.00
0.95
0.90
GS
NORMALIZED TO
= 10V @ I = 21.5A
D
VGS=10V
VGS=20V
TJ = +125°C
TJ = +25°C
TJ = -55°C
0 1
2 3
4 5 6
7 8
9 10
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 4, TRANSFER CHARACTERISTICS
0
45
40
I
D
, DRAIN CURRENT (AMPERES)
BV
DSS
, DRAIN-TO-SOURCE BREAKDOWN
VOLTAGE (NORMALIZED)
1.15
20
40
60
80
100
I
D
, DRAIN CURRENT (AMPERES)
FIGURE 5, R
DS
(ON) vs DRAIN CURRENT
35
30
25
20
15
10
5
0
25
1.10
1.05
1.00
0.95
R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE
(NORMALIZED)
50
75
100
125
150
T
C
, CASE TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE
2.5
I
D
0.90
-50
-25
0
25 50 75 100 125 150
T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
1.2
1.1
1.0
0.9
0.8
0.7
0.6
-50
= 21.5A
= 10V
V
2.0
1.5
1.0
V
GS
(TH), THRESHOLD VOLTAGE
(NORMALIZED)
GS
0.5
0.0
-50
-25
0
25 50
75 100 125 150
T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE
-25
0
25 50 75 100 125 150
T
C
, CASE TEMPERATURE (°C)
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
050-7053 Rev C
9-2004
172
I
D
, DRAIN CURRENT (AMPERES)
100
OPERATION HERE
LIMITED BY RDS (ON)
20,000
10,000
APT6013B2LL_LLL
Ciss
C, CAPACITANCE (pF)
100µS
10
1mS
TC =+25°C
TJ =+150°C
SINGLE PULSE
1,000
Coss
100
Crss
10mS
10
0
10
20
30
40
50
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
200
100
I
D
= 43A
12
VDS= 120V
8
VDS= 300V
VDS= 480V
I
DR
, REVERSE DRAIN CURRENT (AMPERES)
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS)
1
10
100
600
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA
16
1
TJ =+150°C
TJ =+25°C
10
4
40
80
120
160
200
Q
g
, TOTAL GATE CHARGE (nC)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE
100
t
d(off)
80
0
0
1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
V
SD
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
120
V
DD
G
= 400V
R
= 5Ω
100
80
t
r
and t
f
(ns)
T = 125°C
J
L = 100µH
V
DD
G
t
d(on)
and t
d(off)
(ns)
= 400V
60
R
= 5Ω
T = 125°C
J
L = 100µH
60
40
t
f
40
t
d(on)
t
r
20
20
0
10
0
10
40
50
60
70
I
D
(A)
FIGURE 14, DELAY TIMES vs CURRENT
DD
G
20
30
40
50
60
70
I
D
(A)
FIGURE 15, RISE AND FALL TIMES vs CURRENT
3000
2500
SWITCHING ENERGY (µJ)
V
I
DD
20
30
2000
V
= 400V
= 400V
R
= 5Ω
D
J
= 43A
1600
E
on
and E
off
(µJ)
T = 125°C
J
T = 125°C
L = 100µH
E
ON
includes
diode reverse recovery
L = 100µH
E
ON
includes
diode reverse recovery
E
off
2000
1500
1000
500
0
1200
800
E
on
400
E
off
E
on
050-7053 Rev C
9-2004
0
10
40
50
60
70
I
D
(A)
FIGURE 16, SWITCHING ENERGY vs CURRENT
20
30
10 15 20 25 30 35 40 45 50
R
G
, GATE RESISTANCE (Ohms)
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
0
5
APT6013B2LL_LLL
90%
10%
Gate Voltage
T
J
125°C
90%
Drain Current
90%
Gate Voltage
t
d(off)
Drain Voltage
T 125°C
J
t
d(on)
t
r
5%
10%
Switching Energy
5%
Drain Voltage
t
f
10%
0
Switching Energy
Drain Current
Figure 18, Turn-on Switching Waveforms and Definitions
Figure 19, Turn-off Switching Waveforms and Definitions
APT30DF60
V
DD
I
D
V
DS
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
T-MAX
TM
(B2) Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
TO-264 (L) Package Outline
4.60 (.181)
5.21 (.205)
1.80 (.071)
2.01 (.079)
19.51 (.768)
20.50 (.807)
3.10 (.122)
3.48 (.137)
5.79 (.228)
6.20 (.244)
Drain
20.80 (.819)
21.46 (.845)
Drain
25.48 (1.003)
26.49 (1.043)
4.50 (.177) Max.
0.40 (.016)
0.79 (.031)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
2.29 (.090)
2.69 (.106)
19.81 (.780)
21.39 (.842)
2.29 (.090)
2.69 (.106)
1.01 (.040)
1.40 (.055)
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
These dimensions are equal to the TO-247 without the mounting hole.
Dimensions in Millimeters and (Inches)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
050-7053 Rev C
0.48 (.019)
0.84 (.033)
2.59 (.102)
3.00 (.118)
0.76 (.030)
1.30 (.051)
2.79 (.110)
3.18 (.125)
9-2004
19.81 (.780)
20.32 (.800)
Gate
Drain
Source
Gate
Drain
Source

APT6013LLLG Related Products

APT6013LLLG APT6013B2LLG
Description Power Field-Effect Transistor, 43A I(D), 600V, 0.13ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN Power Field-Effect Transistor, 43A I(D), 600V, 0.13ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TMAX-3
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Microsemi Microsemi
package instruction FLANGE MOUNT, R-PSFM-T3 IN-LINE, R-PSIP-T3
Contacts 3 3
Reach Compliance Code compliant compliant
Avalanche Energy Efficiency Rating (Eas) 2500 mJ 2500 mJ
Shell connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 600 V 600 V
Maximum drain current (ID) 43 A 43 A
Maximum drain-source on-resistance 0.13 Ω 0.13 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSFM-T3 R-PSIP-T3
JESD-609 code e1 e1
Number of components 1 1
Number of terminals 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 172 A 172 A
Certification status Not Qualified Not Qualified
surface mount NO NO
Terminal surface TIN SILVER COPPER TIN SILVER COPPER
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal location SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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