HSMR-CL25
0.25mm Blue Leadframe-Based Surface Mount ChipLED
Data Sheet
Description
The HSMR-CL25 series of parts is designed with an ultra
small form factor to allow this miniaturization. The HSMR-
CL25 series is the thinnest available top emitting package
in the market with high brightness InGaN die technology.
The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to
survive temperature conditions of -40°C to 85°C despite its
small size.
The target applications are Keypad backlighting, Push
button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,
Office Automation, Industrial and Commercial
automations, Home Market appliances, Networking,
Medical Instruments, and Mobile Computing. This product
is competitively priced, and production is geared towards
short lead times and ample capacity.
Features
•
Small size top firing
•
Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
•
Compatible with IR Reflow
•
High brightness using InGaN die technology
•
Available in 8mm Tape on 7” (178 mm) Diameter Reels
Advantages
•
High package thermal dissipation capability due to the
superior package leadframe design
•
Small footprint to overcome space count
•
Low thickness to overcome space constrains
•
Short lead times and competitive pricing
CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Notes:
. All dimensions are in millimeters.
2. Tolerance is ±0.mm unless otherwise specified.
Device Selection Guide
Package Dimension (mm)
.6 (L) x 0.8 (W) x 0.25 (H)
Die Technology
InGaN
Colors
Blue
Testing Current (mA)
5
Parts per Reel
4000
Package Description
Untinted, Non-Diffused
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current
[]
Power Dissipation
Reverse Voltage (IR = 00mA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Notes:
1. Derate linearly as shown in Figure 4.
HSMR-CL25
0
39
5
95
-40 to +85
-40 to +85
Units
mA
mW
V
°C
°C
°C
See reflow soldering profile
(Refer to Figures 7 & 8 )
2
Electrical Characteristics at TA = 25°C
Forward Voltage VF (Volts)
[1]
@ IF =5mA
Part Number
HSMR-CL25
Notes:
1. Vf tolerance : ±0.1V
Typ.
2.85
Max.
3.5
Reverse Breakdown
VR (Volts) @ IR = 100mA
Min.
5
Thermal Resistance
Rq
J-PIN
(°C/W)
Typ.
300
Optical Characteristics at TA = 25°C
Luminous Intensity IV
[1]
(mcd)
@ 5mA
Part Number
HSMR-CL25
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. The dominant wavelength,
ld,
is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3.
q
1/2
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Min.
.2
Typ.
8
Peak Wavelength
lpeak
(nm)
Typ.
469
Dominant Wavelength
ld
[2]
(nm)
Typ.
473
Viewing Angle
[3]
(°)
Typ.
20
Light Intensity (IV) Bin Limits
Bin ID
L
M
N
Tolerance : ±15%
Color Bin Limits
Bin ID
B
C
Tolerance : ±1nm
Intensity (mcd)
Minimum
Maximum
.20
8.00
8.00
28.50
28.50
45.00
Dominant Wavelength (nm)
Minimum
Maximum
465.0
470.0
470.0
475.0
Forward Voltage (VF) Bin Limits
Bin ID
2
3
Tolerance : ±0.1V
Forward Voltage (V)
Minimum
Maximum
2.55
2.75
2.75
2.95
2.95
3.5
3
100
90
100
70
60
50
40
30
20
10
0
400
450
500
550
600
WAVELENGTH - nm
650
700
FORWARD CURRENT - mA
RELATIVE INTENSITY - %
80
10
1
0.1
2.0
2.5
3.0
3.5
FORWARD VOLTAGE - V
4.0
Figure 1. Relative intensity vs. wavelength
Figure 2. Forward voltage vs. forward current
2.0
1.8
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 5 mA)
12
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 5 mA)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
8
6
4
2
0
0
2
4
6
8
DC FORWARD CURRENT - mA
10
0
20
40
60
80
DC FORWARD CURRENT - mA
100
Figure 3. Luminous intensity vs. forward current
Figure 4. Maximum forward current vs. ambient temperature
1
0.9
0.8
NORMALIZED INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified.
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
0.8 (0.031)
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Radiation Pattern
4
Figure 6. Recommended soldering land pattern.
10 SEC. MAX.
230
o
C MAX.
TEMPERATURE
TEMPERATURE
10 - 30 SEC.
255 - 260 ˚C
3 ˚C/SEC. MAX.
-6 ˚C/SEC. MAX.
140-160
o
C
4
o
C/SEC MAX.
-3
o
C/SEC MAX.
217 ˚C
200 ˚C
150 ˚C
4
o
C/SEC MAX.
OVER 2 MIN.
TIME
3 ˚C/SEC. MAX.
60 - 120 SEC.
TIME
100 SEC. MAX.
Figure 7. Recommended reflow soldering profile
USER FEED DIRECTION
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free reflow soldering profile.
xxx
xxx
xx
xxx
xx
xxx
xx
xxx
xx
xx
CATHODE SIDE
PRINTED LABEL
Figure 9. Reeling orientation.
∅
13.1 ± 0.5
(∅ 0.516 ± 0.020)
∅
20.20 MIN.
(∅ 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
178.40 ± 1.00
(7.024 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified.
10.50 ± 1.0 (0.413 ± 0.039)
8.0 ± 1.0 (0.315 ± 0.039)
Figure 10. Reel dimensions.
5
Embedded System
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