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CX20493-25

Description
Modem-Support Circuit, 2.4kbps Data, CMOS, QFN-28
CategoryWireless rf/communication    Telecom circuit   
File Size549KB,56 Pages
ManufacturerCONEXANT
Websitehttp://www.conexant.com/
Download Datasheet Parametric Compare View All

CX20493-25 Overview

Modem-Support Circuit, 2.4kbps Data, CMOS, QFN-28

CX20493-25 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCONEXANT
Parts packaging codeQFN
package instructionLQFP, QFP32,.35SQ,32
Contacts28
Reach Compliance Codecompliant
data rate2.4 Mbps
JESD-30 codeS-XQFP-G32
JESD-609 codee0
length7 mm
Number of functions1
Number of terminals32
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialUNSPECIFIED
encapsulated codeLQFP
Encapsulate equivalent codeQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM-SUPPORT CIRCUIT
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width7 mm
CX84100-41/-23 SCXV.22bis Modem
V.22bis Modem with CX20493 SmartDAA®
Line Side Device
Data Sheet
Doc. No. 102339D
January 17, 2012

CX20493-25 Related Products

CX20493-25 CX20493-35
Description Modem-Support Circuit, 2.4kbps Data, CMOS, QFN-28 Modem-Support Circuit, 2.4kbps Data, CMOS, QFN-28
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker CONEXANT CONEXANT
Parts packaging code QFN QFN
package instruction LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32
Contacts 28 28
Reach Compliance Code compliant compliant
data rate 2.4 Mbps 2.4 Mbps
JESD-30 code S-XQFP-G32 S-XQFP-G32
JESD-609 code e0 e0
length 7 mm 7 mm
Number of functions 1 1
Number of terminals 32 32
Maximum operating temperature 70 °C 70 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code LQFP LQFP
Encapsulate equivalent code QFP32,.35SQ,32 QFP32,.35SQ,32
Package shape SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Telecom integrated circuit types MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 7 mm 7 mm
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