FPC Connector
FP-10
SU
SL
Series
1.0mm Spacing (SMT)
CFP05
B
A
●
SU Series
-02
F（Upper Contact）
××
01
02
11
12
No. of Pins
Hold Down Packing Style
With
Without
With
Without
Embossed Taping
Embossed Taping
Pack in Bulk
Pack in Bulk
1.0
C
2.4
1.5
■
Features
1. The contact positions of the connectors are
classified into upper and lower types.
2. Of the ZIF structure.
3. Supplied in emboss-tape packaging for
automatic mounting.
4. A lead-free product.
2.4
0.3
D
3.4
(Inserted size)
●
SL Series
CFP15
B
A
1.7
5.2
(2.0)
-01
F（Lower Contact）
××
01
02
11
12
No. of Pins
■
Specifications
1. Rating : 0.5A, 50V AC/DC
2. Contact Resistance : 30mΩ, max.
3. Insulation Resistance : 1000MΩ, min. at 500V DC
4. Withstanding Voltage : 500V AC for one minute
5. Operating Temperature Range : –25˚C to +70˚C
Hold Down Packing Style
With
Without
With
Without
Embossed Taping
Embossed Taping
Pack in Bulk
Pack in Bulk
1.0
C
2.4
0.3
2.4
D
3.4
(Inserted size)
No. of Pins
04
05
06
07
08
09
10
11
12
13
14
15
16
A
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
14.0
15.0
B
5.1
6.1
7.1
8.1
9.1
10.1
11.1
12.1
13.1
14.1
15.1
16.1
17.1
C
9.7
10.7
11.7
12.7
13.7
14.7
15.7
16.7
17.7
18.7
19.7
20.7
21.7
1.7
●
Housing : Polyphenylene Sulfide (PPS),
Natural Color, 94V-0
●
Cover : Polyphenylene Sulfide (PPS),
Natural Color, 94V-0
●
Contact : Phosphor Bronze, Sn Plating
●
Frame : Phosphor Bronze, Sn-Cu Plating
1.5
■
Material and Plating
5.2
(2.0)
D
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
No. of Pins
17
18
19
20
21
22
23
24
25
26
28
29
30
A
16.0
17.0
18.0
19.0
20.0
21.0
22.0
23.0
24.0
25.0
27.0
28.0
29.0
B
18.1
19.1
20.1
21.1
22.1
23.1
24.1
25.1
26.1
27.1
29.1
30.1
31.1
C
22.7
23.7
24.7
25.7
26.7
27.7
28.7
29.7
30.7
31.7
33.7
34.7
35.7
D
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
26.5
28.5
29.5
30.5
■ P.C. Board Dimension
■ Applicable FPC Dimension
（t＝0.3±0.05）
(A 2)
±
0.1
2.4
0.5
1.0
±
0.15
A
±
0.05
1.0
±
0.05
0.6
– 0.05
4min
+ 0.1
3.0
2.6
0.5
A
±
0.05
(D 0.6)
+0.1
0
+0.1
0
(Spacing)1.0
±
0.05
●
FPC plating to recommend : Sn plating
0.25
2
17
Embedded System
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