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SMBJ70ACA

Description
4000 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA
Categorysemiconductor    Discrete semiconductor   
File Size111KB,10 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

SMBJ70ACA Overview

4000 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA

SMBJ70ACA Parametric

Parameter NameAttribute value
Number of terminals2
Number of components1
Minimum breakdown voltage14.4 V
Processing package descriptionROHS COMPLIANT, PLASTIC, SMB, 2 PIN
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formC BEND
terminal coatingMATTE Tin
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
CraftsmanshipAVALANCHE
structuresingle
Diode component materialssilicon
Maximum power consumption limit5 W
polarityTwo-way
Diode typeTRANS voltage SUPPRESSOR diode
shutdown voltage13 V
Maximum non-repetitive peak speed power4000 W
SMBJ
Transil™
Features
Peak pulse power:
– 600 W (10/1000
μs)
– 4 kW (8/20 µs)
Stand off voltage range: from 5 V to 188 V
Unidirectional and bidirectional types
Low leakage current:
– 0.2 µA at 25 °C
– 1 µA at 85 °C
Operating T
j max
: 150 °C
High power capability at T
j max
:
– 515 W (10/1000 µs)
JEDEC registered package outline
A
K
Unidirectional
Bidirectional
SMB
(JEDEC DO-214AA)
Description
The SMBJ Transil series has been designed to
protect sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 600 W (10/1000
μs).
Planar technology makes these devices suitable
for high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
SMBJ are packaged in SMB (SMB footprint in
accordance with IPC 7531 standard).
Complies with the following standards
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-5
MIL STD 883G, method 3015-7 Class 3B:
– 25 kV HBM (human body model)
Resin meets UL 94, V0
MIL-STD-750, method 2026 soldererability
EIA STD RS-481 and IEC 60286-3 packing
IPC 7531 footprint
TM:
Transil is a trademark of STMicroelectronics
October 2010
Doc ID 5616 Rev 10
1/10
www.st.com
10
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