|
WSF512K32V-29G2TM |
WSF512K32V-29G2TI |
| Description |
Memory Circuit, Flash+SRAM, Hybrid, CQFP68, |
Memory Circuit, Flash+SRAM, Hybrid, CQFP68, |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
White Electronic Designs Corporation |
White Electronic Designs Corporation |
| Reach Compliance Code |
unknown |
unknown |
| Maximum access time |
90 ns |
90 ns |
| JESD-30 code |
S-XQFP-G68 |
S-XQFP-G68 |
| JESD-609 code |
e0 |
e0 |
| Memory IC Type |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
| Mixed memory types |
FLASH+SRAM |
FLASH+SRAM |
| Number of terminals |
68 |
68 |
| Maximum operating temperature |
125 °C |
85 °C |
| Minimum operating temperature |
-55 °C |
-40 °C |
| Package body material |
CERAMIC |
CERAMIC |
| encapsulated code |
QFP |
QFP |
| Encapsulate equivalent code |
QFP68,1.1SQ,50 |
QFP68,1.1SQ,50 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
FLATPACK |
FLATPACK |
| power supply |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum standby current |
0.07 A |
0.07 A |
| Maximum slew rate |
0.55 mA |
0.55 mA |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
| technology |
HYBRID |
HYBRID |
| Temperature level |
MILITARY |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |