MT9JSF51272AIZ-1G1XX datasheet, PDF

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MT9JSF51272AIZ-1G1XX: DescriptionDDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240; Categorystorage storage; File Size411KB，25 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT9JSF51272AIZ-1G1XX Overview

DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240

MT9JSF51272AIZ-1G1XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	HALOGEN FREE, MO-269, UDIMM-240
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
memory density	38654705664 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	DUAL

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1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR3 SDRAM UDIMM

Features

DDR3 SDRAM UDIMM

MT9JSF12872AZ – 1GB

MT9JSF25672AZ – 2GB

MT9JSF51272AZ – 4GB

Features

•

DDR3 functionality and operations supported as de-

fined in the component data sheet

•

240-pin, unbuffered dual in-line memory module

(UDIMM)

•

Fast data transfer rates: PC3-12800, PC3-10600,

PC3-8500, or PC3-6400

•

1GB (128 Meg x 72), 2GB (256 Meg x 72), and 4GB

(512 Meg x 72)

•

= 1.5V ±0.075V

•

DDSPD

= +3.0V to +3.6V

•

Supports ECC error detection and correction

•

Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

•

Single rank

•

On-board I

C temperature sensor with integrated se-

rial presence-detect (SPD) EEPROM

•

Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

•

Selectable BC4 or BL8 on-the-fly (OTF)

•

Gold edge contacts

•

Halogen-free

•

Fly-by topology

•

Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80C

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

800

667

RCD

Figure 1: 240-Pin UDIMM (MO-269 R/C D)

Module height: 30mm (1.18in)

Options

•

Operating

–

Commercial (0°C

≤

+70°C)

–

Industrial (–40°C

≤

+85°C)

•

Package

–

240-pin DIMM (halogen-free)

•

Frequency/CAS latency

–

1.25ns @ CL = 11 (DDR3-1600)

–

1.5ns @ CL = 9 (DDR3-1333)

–

1.87ns @ CL = 7 (DDR3-1066)

Note:

temperature

Marking

None

-1G6

-1G4

-1G1

1. Contact Micron for industrial temperature

module offerings.

(ns)

13.125

12.5

(ns)

13.125

12.5

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef8360c8e6

jsf9c128_256_512x72az.pdf - Rev. C 9/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT9JSF51272AIZ-1G1XX Related Products

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Description	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	MODULE DDR3 SDRAM 1GB 240UDIMM	MODULE DDR3 SDRAM 1GB 240UDIMM	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240	DDR DRAM Module, 128MX72, CMOS, HALOGEN FREE, MO-269, UDIMM-240
Maker	Micron Technology	-	-	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	-	-	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	HALOGEN FREE, MO-269, UDIMM-240	-	-	DIMM,	DIMM,	HALOGEN FREE, MO-269, UDIMM-240	HALOGEN FREE, MO-269, UDIMM-240	HALOGEN FREE, MO-269, UDIMM-240	HALOGEN FREE, MO-269, UDIMM-240	HALOGEN FREE, MO-269, UDIMM-240
Contacts	240	-	-	240	240	240	240	240	240	240
Reach Compliance Code	unknown	-	-	compliant	unknown	unknown	unknown	unknown	unknow	unknow
ECCN code	EAR99	-	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	-	-	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH	-	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	-	-	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
memory density	38654705664 bit	-	-	9663676416 bit	9663676416 bit	19327352832 bit	38654705664 bit	9663676416 bit	38654705664 bi	9663676416 bi
Memory IC Type	DDR DRAM MODULE	-	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	-	-	72	72	72	72	72	72	72
Number of functions	1	-	-	1	1	1	1	1	1	1
Number of ports	1	-	-	1	1	1	1	1	1	1
Number of terminals	240	-	-	240	240	240	240	240	240	240
word count	536870912 words	-	-	134217728 words	134217728 words	268435456 words	536870912 words	134217728 words	536870912 words	134217728 words
character code	512000000	-	-	128000000	128000000	256000000	512000000	128000000	512000000	128000000
Operating mode	SYNCHRONOUS	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	-	85 °C	70 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	512MX72	-	-	128MX72	128MX72	256MX72	512MX72	128MX72	512MX72	128MX72
Package body material	UNSPECIFIED	-	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	-	-	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	-	-	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	-	-	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	-	-	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	-	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	-	-	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	-	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	-	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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