EEWORLDEEWORLDEEWORLD

Part Number

Search

5-HCIS101-04TG

Description
IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size146KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

5-HCIS101-04TG Overview

IC Socket, PGA101, 101 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

5-HCIS101-04TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Other features1.0 OZ. AVG. INSERTION FORCE
body width1.2 inch
subject depth0.12 inch
body length1.2 inch
Contact structure12X12
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA101
Shell materialGLASS FILLED THERMOPLASTIC
JESD-609 codee0
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts101
Maximum operating temperature260 °C
Minimum operating temperature-60 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Low Insertion Force
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Molded & FR-4 Low Insertion Force PGA Sockets
.100
(2.54)
.062
(1.57)
Molded
PC Board
FR-4
PC Board
Features:
• As low as 1 oz.(28.34 g) average insertion
force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% anti-
wicking of solder.
• Tapered entry for ease of insertion.
• To fit .100” (2.54 mm) grid.
• Easily customized to fit your application.
How To Order
1 oz. (28.34 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CIS - Standard Molded
HCIS - High Temp. Molded
FIS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
CIS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
How To Order
2.5 oz. (70.85 g) Average Insertion Force Sockets
1
Footprint Dash #
If Applicable*
Body Type
CS - Standard Molded
HCS - High Temp. Molded
FS - FR-4
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Solder Preform:
63% Tin, 37% Lead
CS
068
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Terminal Type
See next page
for terminal types
Sealant Options
RTV
Seal
Body Material:
CS/CIS -
Glass Filled Thermoplastic
Polyester (P.B.T.), U.L. Rated 94V-O,
-60˚C to 140˚C (-76˚F to 284˚F)
HCS/HCIS -
High Temp. Glass Filled
Thermoplastic (P.P.S.) , U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
FS/FIS -
FR-4 Fiberglass Epoxy Board,
U.L. Rated 94V-O, Index 140˚C (284˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Tape Sealed
To order: Add 3M to end of part #
Page 32
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Comparison of Current Sampling Methods for SVPWM Inverter Power Supply
Comparison of current sampling methods for SVPWM inverter power supplies....
terrykgm DSP and ARM Processors
STM32 based SD card
I'm looking for a file system and routine for an SD card based on stm32. I'm using this, but there are only stm32 library functions and no files related to the SD card. Please give me some advice....
yyup stm32/stm8
What should you learn if you want to become an embedded system expert?
My major is automation...
helyboy_1999 Embedded System
Let's take a look at the application of TI products in Meizu fast charging mobile power bank
Not long ago, Meizu released a 10000mAh mobile power bank at the MX5 mobile phone launch conference and launched it on JD.com. Here we can see the application of TI BQ25895 in Meizu's fast-charging mo...
alan000345 Analogue and Mixed Signal
I encountered a problem when using J-LINK to download the program. I hope you can help me solve it.
When I download the program, the connection is correct, but when I click target->auto, the following prompt appears: "program (0x8000000-0x8001567) does not fit into selected flash sectors". I would l...
千霜凌 stm32/stm8
Please help me look at this code, if you have any questions please ask!
#include "msp430x54x.h" void main(void) { WDTCTL = WDTPW + WDTHOLD; //Stop watchdog timer P1DIR |= 0x01; //Set P1.0 as output TA1CTL = RT1SSEL_0 + MC_2 + TAIE; // ACLK, timer A counting mode, and enab...
wuyanyanke Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2750  2451  400  69  2089  56  50  9  2  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号