|
8X60/BXA |
8X60/B3A |
N8X60N |
| Description |
Memory Controller, TTL, CDIP28 |
Memory Controller, TTL, CQCC28 |
Memory Controller, TTL, PDIP28 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Maker |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction |
DIP, DIP28,.6 |
QCCN, LCC28,.45SQ |
DIP, DIP28,.6 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| JESD-30 code |
R-XDIP-T28 |
S-XQCC-N28 |
R-PDIP-T28 |
| JESD-609 code |
e0 |
e0 |
e0 |
| Number of terminals |
28 |
28 |
28 |
| Maximum operating temperature |
125 °C |
125 °C |
70 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
- |
| Package body material |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
QCCN |
DIP |
| Encapsulate equivalent code |
DIP28,.6 |
LCC28,.45SQ |
DIP28,.6 |
| Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
| Package form |
IN-LINE |
CHIP CARRIER |
IN-LINE |
| power supply |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum slew rate |
140 mA |
140 mA |
140 mA |
| Nominal supply voltage |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
NO |
| technology |
TTL |
TTL |
TTL |
| Temperature level |
MILITARY |
MILITARY |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
NO LEAD |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
QUAD |
DUAL |
| Filter level |
38535Q/M;38534H;883B |
38535Q/M;38534H;883B |
- |