SILICON, VHF-UHF BAND, MIXER DIODE, DO-35
| Parameter Name | Attribute value |
| Maker | STMicroelectronics |
| package instruction | O-LALF-W2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | MATCHED BATCH AVAILABLE |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Maximum diode capacitance | 2 pF |
| Diode component materials | SILICON |
| Diode type | MIXER DIODE |
| frequency band | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
| JEDEC-95 code | DO-35 |
| JESD-30 code | O-LALF-W2 |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum operating temperature | 200 °C |
| Minimum operating temperature | -65 °C |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | SCHOTTKY |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| BAR28-AR1 | BAR28-AZ2 | BAR28-AZ1 | BAR28-B2 | |
|---|---|---|---|---|
| Description | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 |
| package instruction | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum diode capacitance | 2 pF | 2 pF | 2 pF | 2 pF |
| Diode component materials | SILICON | SILICON | SILICON | SILICON |
| Diode type | MIXER DIODE | MIXER DIODE | MIXER DIODE | MIXER DIODE |
| frequency band | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
| JEDEC-95 code | DO-35 | DO-35 | DO-35 | DO-35 |
| JESD-30 code | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Number of components | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 |
| Maximum operating temperature | 200 °C | 200 °C | 200 °C | 200 °C |
| Minimum operating temperature | -65 °C | -65 °C | -65 °C | -65 °C |
| Package body material | GLASS | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO |
| technology | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY |
| Terminal form | WIRE | WIRE | WIRE | WIRE |
| Terminal location | AXIAL | AXIAL | AXIAL | AXIAL |
| Maker | STMicroelectronics | - | STMicroelectronics | STMicroelectronics |