DISCRETE SEMICONDUCTORS
DATA SHEET
BGY120A; BGY120B; BGY120D
UHF amplifier modules
Objective specification
File under Discrete Semiconductors, SC09
1996 May 29
Philips Semiconductors
Objective specification
UHF amplifier modules
FEATURES
•
Single 3.6 V nominal supply voltage
•
1.2 W output power
•
Easy control of output power by DC voltage
•
Very high efficiency (typ. 55%)
•
Silicon bipolar technology
•
Standby current less than 100
µA.
APPLICATIONS
•
Hand-held transmitting equipment operating in the
824 to 849 MHz, 872 to 905 MHz and 898 to 928 MHz
frequency ranges.
DESCRIPTION
The BGY120A, BGY120B, and BGY120D are three-stage
UHF amplifier modules in a SOT388A package.
Each module consists of three NPN silicon planar
transistor dies, mounted together with matching and bias
components on a metallized ceramic substrate.
The modules produce an output power of 1.2 W into a load
of 50
Ω
with an RF drive power of 2 mW.
QUICK REFERENCE DATA
RF performance at T
mb
= 25
°C.
TYPE
NUMBER
BGY120A
BGY120B
BGY120D
MODE OF
OPERATION
CW
CW
CW
f
(MHz)
824 to 849
872 to 905
898 to 928
V
S
(V)
3.6
3.6
3.6
P
L
(W)
1.2
1.2
1.2
BGY120A; BGY120B;
BGY120D
PINNING - SOT388A
PIN
1
2
3
4
Flange
RF input
V
C
V
S
RF output
ground
DESCRIPTION
1
Top view
2
3
4
MSA486
Fig.1 Simplified outline.
G
P
(dB)
≥
27.8
≥
27.8
≥
27.8
η
(%)
typ. 55
typ. 55
typ. 55
Z
S
; Z
L
(Ω)
50
50
50
1996 May 29
2
Philips Semiconductors
Objective specification
UHF amplifier modules
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
S
V
C
P
D
P
L
T
stg
T
mb
DC supply voltage
DC control voltage
input drive power
load power
storage temperature
operating mounting base temperature
PARAMETER
BGY120A; BGY120B;
BGY120D
MIN.
−
−
−
−
−40
−30
MAX.
5.5
3.5
5
1.6
+100
+100
V
V
UNIT
mW
W
°C
°C
CHARACTERISTICS
Z
S
= Z
L
= 50
Ω;
P
D
= 2 mW; V
S
= 3.6 V; V
C
≤
3 V; T
mb
= 25
°C;
unless otherwise specified.
SYMBOL
f
PARAMETER
frequency
BGY120A
BGY120B
BGY120D
I
Q
I
C
P
L
G
p
η
H
2
H
3
VSWR
in
total quiescent current
control current
load power
power gain
efficiency
second harmonic
third harmonic
input VSWR
stability
adjust V
C
for P
L
= 1.2 W
adjust V
C
for P
L
= 1.2 W
adjust V
C
for P
L
= 1.2 W
adjust V
C
for P
L
= 1.2 W
adjust V
C
for P
L
= 1.2 W
P
D
= 0 to +6 dBm; V
S
= 3 to 4.8 V;
V
C
= 0 to 3 V; P
L
≤
1.2 W;
VSWR
≤
6 : 1 through all phases
V
C
= 0
adjust V
C
for P
L
= 1.2 W;
bandwidth = 30 kHz;
f
n
= f
o
+ 45 MHz
V
S
= 4.8 V;
adjust V
C
for P
L
= 1.4 W;
VSWR
≤
10 : 1 through all phases
V
C
= 0; P
D
<
−60
dBm
adjust V
C
for P
L
= 1.2 W
824
872
898
−
−
1.2
27.8
50
−
−
−
−
−
−
−
−
−
−
−
55
−
−
−
−
849
905
928
100
500
−
−
−
−40
−40
3:1
−60
dBc
MHz
MHz
MHz
µA
µA
W
dB
%
dBc
dBc
CONDITIONS
MIN.
TYP.
MAX.
UNIT
isolation
P
n
noise power
−
−
−
−
−40
−90
dBm
dBm
ruggedness
no degradation
1996 May 29
3
Philips Semiconductors
Objective specification
UHF amplifier modules
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210
°C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Footprints for soldering should cover the module contact
area +0.1 mm on all sides.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250
°C
and damage the module.
The maximum temperature profile and soldering time is
indicated as follows (see Fig.2):
t = 350 s at 100
°C
t = 300 s at 125
°C
t = 200 s at 150
°C
t = 100 s at 175
°C
t = 50 s at 200
°C
t = 5 s at 250
°C
(maximum temperature).
Cleaning
The following fluids may be used for cleaning:
•
Alcohol
•
Bio-Act (Terpene Hydrocarbon)
•
Triclean B/S
•
Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
100
300
BGY120A; BGY120B;
BGY120D
MLB740
handbook, halfpage
T mb
(
o
C)
200
0
0
100
200
300
t (s) 400
Fig.2 Maximum allowable temperature profile.
1996 May 29
4
Philips Semiconductors
Objective specification
UHF amplifier modules
PACKAGE OUTLINE
BGY120A; BGY120B;
BGY120D
handbook, full pagewidth
17.3
16.9
0.2
max
17.1
16.7
2.2
1.8
0.15
7.7
7.3
12.2
11.8
0.7
0.3
3.45
3.05
1
2
3
0.56 (4×)
0.46
2.3
1.9
5.08
5.08
2.54
4
0.30
0.20
0.25 M
(4×)
MSA485
Dimensions in mm.
Fig.3 SOT388A.
1996 May 29
5
京公网安备 11010802033920号
EEWORLD
