Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1:
LX has internal clamp diodes to PGND and BATTP. Applications that forward bias these diodes should take care not to
exceed the IC’s package power dissipation limits.
ELECTRICAL CHARACTERISTICS
(V
BATT
= V
BATTP
= 3.6V,
SHDN
=
SKIP
= BATT, V
REFIN
= 1.932V (MAX8500, MAX8502), V
REFIN
= 1.70V (MAX8501, MAX8503), C
REF
= 0.22µF, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
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