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MC9S08RE60CFJ

Description
IC,MICROCONTROLLER,8-BIT,CMOS,QFP,32PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,234 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MC9S08RE60CFJ Overview

IC,MICROCONTROLLER,8-BIT,CMOS,QFP,32PIN,PLASTIC

MC9S08RE60CFJ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeQFP
package instruction7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
Contacts32
Reach Compliance Codenot_compliant
ECCN codeEAR99
Has ADCNO
Address bus width
bit size8
maximum clock frequency16 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G32
JESD-609 codee0
length7 mm
Humidity sensitivity level3
Number of I/O lines27
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)240
power supply1.8/3.6 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)61440
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed8 MHz
Maximum slew rate4.8 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
MC9S08RC8/16/32/60
MC9S08RD8/16/32/60
MC9S08RE8/16/32/60
MC9S08RG32/60
Data Sheet
HCS08
Microcontrollers
MC9S08RG60/D
Rev. 1.11
06/2005
freescale.com
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