PSC
Vishay Electro-Films
RF Spiral Inductor for Wire Bonded Assemblies
FEATURES
•
Wire bond assembly
•
Small size: 45 mils x 45 mils x 10 mils
•
Low DCR, high Q
•
Low parasitic capacitance, high SRF
APPLICATIONS
•
RF choking for DC biasing
PSC series RF spiral inductors are designed for RF circuits
that require wire bondable components. High precision
equivalent circuit modeling enables accurate computer
simulation of component performance. Additional values
and form factors available upon request.
•
RF tuning circuits
•
Lumped element filters
STANDARD SPECIFICATIONS
PARAMETER
Substrate Material
Conductor Material
Conductor Thickness
Inductance Range
Tolerance
(1)
Maximum Power Handling
Operating Temperature
Storage Temperature
Bond Pad Diameter
(2)
Notes
(1)
(2)
SPECIFICATIONS
Alumina 99.6 %
Gold
5 µm ± 10 %
1 nH to 100 nH
± 20 %
250 mW
- 55 °C to + 125 °C
- 55 °C to + 125 °C
6 mil
Main source of value tolerance is due to variation in wire bonds. See “text fixture” section below.
Bond pad geometry can be modified upon request.
RF CHARACTERISTICS
PART NUMBER
INDUCTANCE VALUE
(nH)
250 MHz
PSC3500C
PSC1050B
PSC1250B
PSC1800B
PSC4500B
Note
(1)
DCR
(Ω)
0.26
0.9
0.9
1.25
3.4
1000 MHz
3.5
10.5
12.5
18
50
IN-CIRCUIT
INDUCTANCE VALUE
(nH)
(1)
6
12
15
20.5
47.5
IN-CIRCUIT DCR
(Ω)
(1)
250 MHz
0.36
1
1
1.35
3.5
8
10
12
13
13
Q
1000 MHz
14
16
18
15
8
SRF
(GHz)
10.2
5.5
5.0
4.2
2.4
3.5
10.5
12.5
18
45
Including the added inductance and resistance of typical bond wires. See equivalent circuit section.
Document Number: 61050
Revision: 28-Sep-09
For technical questions, contact:
efi@vishay.com
www.vishay.com
1
PSC
Vishay Electro-Films
RF Spiral Inductor for Wire Bonded
Assemblies
DIMENSIONS
in inches [millimeters]
0.045
LENGTH
WIDTH
THICKNESS
BOND PAD
DIAMETER
0.006
0.045 ± 0.002
[1.143 ± 0.051]
0.045 ± 0.002
[1.143 ± 0.051]
0.010 ± 0.001
[0.254 ± 0.0254]
0.006
[0.152]
GLOBAL PART NUMBER INFORMATION
Global Part Number: PSC4000CL4A1GNHW1
Global Part Number Description: PSC 4 nH 25 % 45 x 45 x 10 Au None H W1
P
S
C
4
0
0
0
C
L
4
A
1
G
N
H
W
1
MODEL
PSC
INDUCTANCE
(nH)
The first 4
digits are
significant
figures of
inductance
INDUCTANCE
TOLERANCE
MULTIPLIER
CODE
CODE
C
= 0.001
B
= 0.01
A
= 0.1
M
= 20 %
L
= 25 %
SIZE
SUBSTRATE
THICKNESS
TERMINATION
(mil)
1
= 10
G
= Au
BACK
METAL
TEST
CLASS
PACKAGING
CODE
W1
=
Waffle pack,
1 min, 1 mult
TS = Tape
and Reel
100 min,
1 mult
4
= 45 x 45
A
= Alumina
G
= Au
H
= Class H
N
= None
K
= Class K
EQUIVALENT CIRCUIT
The inductor’s spiral trace presents a substantial amount of series resistance, and the close spacing of the spiral turns presents
measurable amounts of stray capacitance that interact with the inductive characteristics.
A useful tool commonly used to model the behavior of electronic components at high frequency is the equivalent circuit model.
While the equivalent circuit model accurately predicts the reactive part of the total impedance, it fails to determine the real part
of the response at high frequency. This is due to the fact that the model does not include skin and proximity effects that
significantly increase the real part of the impedance as the frequency rises.
Bond
Wire
Spiral Inductor
The equivalent circuit values are presented in the table
below:
R
bw
L
bw
L
R
EQUIVALENT CIRCUIT MODEL 2
INDUCTANCE VALUE
L
(nH)
3.5
DCR
R
(Ω)
0.26
0.9
0.9
1.25
3.4
SHUNT CAP.
C
(fF)
71
80
81
84
92
TYP.
R
bw (1)
(Ω)
0.1
0.1
0.1
0.1
0.1
TYP.
L
bw (1)
(nH)
2.5
2.5
2.5
2.5
2.5
C
10.5
12.5
L:
Desired inductance
R:
Parasitic self resistance
C:
Parasitic shunt capacitance
R
bw
:
Bond
wire
self resistance
L
bw
:
Parasitic
bond wire
inductance
Fig. 1 - Equivalent Circuit
18
45
Note
(1)
Typical bond wires are approximated as being 1.25 mil in
diameter gold, totaling a length of 3 mm. The resistance listed
above includes the added effect of the bond wire adhesion to the
substrate and component.
Document Number: 61050
Revision: 28-Sep-09
www.vishay.com
2
For technical questions, contact:
efi@vishay.com
PSC
RF Spiral Inductor for Wire Bonded
Assemblies
COMPONENT PERFORMANCE
Abs (Z)/Z
0
2.1
2.0
1.9
1.8
1.7
45 nH
1.6
1.5
1.4
1.3
1.2
1.1
3.5 nH
1.0
0.9
10
100
1000
10 000
10.5 nH
18 nH
12.5 nH
Vishay Electro-Films
Frequency (MHz)
Fig. 2 - Relative Impedance vs. Frequency
LAYOUT CONSIDERATIONS
The RF spiral inductor is electrically connected to the circuit by wire bonds. All wire bonds add parasitic inductance and
resistance, as shown in Figure 1.
It is important to note that setup variations might affect the performance of the component. Special care must be given to minimize
these effects by careful design of the component host circuit board. The following aspects should be considered:
•
Bond wire length should be minimized. The bond wire added inductance can be roughly estimated at 0.75 nH per mm of
1.25 mil diameter gold wire.
•
Any ground plane directly under the component will increase the parasitic shunt capacitance. This will cause self-resonance at
lower frequencies.
•
The epoxy used to attach the component is the limiting factor in power handling. For applications that require high power
handling it is recommended to use high temperature epoxy and to ensure adequate heat sinking.
Document Number: 61050
Revision: 28-Sep-09
For technical questions, contact:
efi@vishay.com
www.vishay.com
3
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www.vishay.com
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
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Revision: 12-Mar-12
1
Document Number: 91000
DSP and ARM Processors
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