REVISIONS
LTR
A
B
DESCRIPTION
Drawing updated to reflect current requirements. - lgt
Corrections to table I test conditions and footnote. Editorial changes throughout. -
drw
DATE (YR-MO-DA)
01-06-13
04-06-14
APPROVED
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Rick C. Officer
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
APPROVED BY
Michael Frye
DRAWING APPROVAL DATE
90-01-02
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, WIDEBAND RMS-TO-DC
CONVERTER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
9
5962-89637
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E311-04
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89637
01
C
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows:
Device type
01
Generic number
AD637
Circuit function
Wideband RMS-to-DC converter
1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 and as follows:
Outline letter
C
Descriptive designator
GDIP1-T14 or CDIP2-T14
Terminals
14
Package style
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Positive supply voltage (+V
S
) ....................................................................
Negative supply voltage (-V
S
)....................................................................
Output short circuit duration......................................................................
Storage temperature range.......................................................................
Lead temperature (soldering, 10 seconds)...............................................
Internal quiescent power dissipation .........................................................
Thermal resistance, junction to case (θ
JC
)................................................
Thermal resistance, junction to ambient (θ
JA
)...........................................
Junction temperature (T
J
) .........................................................................
+18 V dc
-18 V dc
Indefinite
-65°C to +150°C
+300°C
108 mW
See MIL-STD-1835
95°C/W
+175°C
1.4 Recommended operating conditions.
Positive supply voltage (+V
S
) .................................................................... +15 V dc
Negative supply voltage (-V
S
).................................................................... -15 V dc
Ambient operating temperature range (T
A
)............................................... -55°C to +125°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89637
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Functional block diagram. The functional block diagram shall be as specified on figure 2.
3.2.3 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89637
SHEET
B
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages
where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance
with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing
as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix
A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix
A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89637
SHEET
B
4
TABLE I. Electrical performance characteristics.
Conditions
+V
S
= +15 V, -V
S
= -15 V
-55°C
≤
T
A
≤+125°C
unless otherwise specified
V
IN
= 0 V to
±10
V
Test
Symbol
Group A
subgroups
Device
type
Limits
Unit
Min
Total error
Total error versus
positive supply
E
T
1
2, 3
01
Max
1/
1/
1/
∆
E
T
∆ +
V
S
∆
E
T
∆
- V
S
E
TR
NL
1
+5.0 V
≤
+V
S
≤
+15 V
-5.0 V
≤
-V
S
≤
-15 V
1, 2, 3
1
2
01
01
±150
±300
±500
µV/V
µV/V
Total error versus
negative supply
DC reversal error
2.0 V fullscale
nonlinearity
7.0 V fullscale
nonlinearity
Output offset voltage
Output offset voltage
temperature coefficient
Output voltage swing
at RMS OUT
I
REF
0
2/
for 0 dB = 1.0 V rms
I
REF
range
2/
Buffer input offset
voltage
Buffer input current
Denominator input
resistance
2/
Denominator input
offset voltage
2/
Power supply range
Quiescent current
Standby current
1/
V
IN
=
±2.0
V, T
A
= +25°C
10 mV
≤
|V
IN
|
≤
2.0 V
1
1
2, 3
01
01
±.25
±.04
±.06
% of
reading
% of FS
NL
2
10 mV
≤
|V
IN
|
≤
7.0 V
1
2, 3
01
±.05
±.14
% of FS
V
OSO
∆
V
OSO
∆
T
V
OP
I
REF1
I
REF2
V
OS2
I
IN
R
DEN
V
OS3
V
S
I
Q
I
SB
V
IN
= GND
V
IN
= GND
R
L
= 2.0 kΩ
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
T
A
= 25°C
V
S
=
±18
V
V
CS
≤
0.2 V, T
A
= +25°C
1
2, 3
2, 3
1, 2, 3
1
1
1
1
4
1
1
1, 2, 3
1
01
01
01
01
01
01
01
01
01
01
01
01
±3.0
20
12
5.0
1.0
±1.0
±6.0
±.07
mV
mV/°C
V
80
100
±2.0
±10
30
±0.5
±18
3.0
450
µA
µA
mV
nA
kΩ
mV
V
mA
µA
For subgroup 1, the maximum total error is
±1.0
mV
±0.5%
of reading. For subgroup 2 and 3, the maximum total error is
±6.0
mV
±0.7%
of reading. Total error represents the maximum deviation of the dc component of the output voltage from the
theoretical output value over a specified range of signal amplitude and frequency. It is shown as the sum of a fixed error and a
component proportional to the theoretical output (percentage of reading). The fixed error component includes all offset errors
and irreducible nonlinearities; the percentage of reading component includes the linear scale-factor error.
If not tested, shall be guaranteed to the limits specified in table I.
2/
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89637
SHEET
B
5
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