Intel® 82575EB Gigabit Ethernet
Controller Datasheet
LAN Access Division
317679-004
Revision: 2.11
January 2011
Intel
®
82575EB Gigabit Ethernet Controller — Legal
Legal
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Intel
®
82575EB Gigabit Ethernet Controller
Datasheet
2
317679-004
Revision: 2.11
January 2011
Revisions — Intel
®
82575EB Gigabit Ethernet Controller
Revisions
Date
8/2005
1/2006
7/2006
2/2007
6/2007
12/13/2010
Revision
0.10
0.25
0.50
0.75
1.0
2.0
Description
Initial Release
Added general information, updated pins list
Removed information regarding Fast Management Link; added general information
Added measured power values; corrected Visual Pin Assignment Diagrams (RBIAS0_N and
RBIAS1_N corrected to VSS).
Updated classification, changed RMII to NC-SI, updated pin list, updated NC-SI timing specs.
changed LAN_PWR_GOOD to Internal_Power_On_Reset.
Section 2.1, PCI Express Features
- Support for x4, x2, and x1 modes now indicated.
Section 3.5, MDIO Signals
- MDC pin now listed as type 0.
Section 3.7, LED Signals
- Introductory note updated.
Section 9.2, Pin Map
- Corrected information applicable to pins AC5, AC16, AC17, AD16,
AD17, B12, K14.
1/28/2011
2.1
Update Doc title to match brand string.
Table 7, DC Characteristics
- VCC(1.0) row updated. See bold.
1/28/2011
2.11
Build issue corrected.
317679-004
Revision: 2.11
January 2011
Intel
®
82575EB Gigabit Ethernet Controller
Datasheet
3
Intel
®
82575EB Gigabit Ethernet Controller — Contents
Contents
1.0
1.1
1.2
1.3
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Introduction
.............................................................................................................................5
Document Scope ......................................................................................................................... 5
References ................................................................................................................................. 6
Block Diagram............................................................................................................................. 6
Features of the 82575EB Gigabit Ethernet Controller
................................................................7
PCI Express Features ................................................................................................................... 7
MAC-Specific Features.................................................................................................................. 7
PHY-Specific Features .................................................................................................................. 8
Host Offloading Features .............................................................................................................. 8
Manageability Features................................................................................................................. 9
Additional Device Features .......................................................................................................... 10
Technology Features .................................................................................................................. 10
3.0
Signal Descriptions and Pinout List
......................................................................................... 11
3.1
Signal Type Definitions ............................................................................................................... 11
3.2
PCI Express Interface................................................................................................................. 12
3.3
Power Management Signals ........................................................................................................ 12
3.4
System Management Interface Signals ......................................................................................... 13
3.5
MDIO Signals ............................................................................................................................ 13
3.6
SPI EEPROM and FLASH Signals................................................................................................... 13
3.7
LED Signals .............................................................................................................................. 14
3.8
Other Signals ............................................................................................................................ 15
3.9
Crystal Signals .......................................................................................................................... 15
3.10
PHY Analog Signals .................................................................................................................... 15
3.11
Serializer/Deserializer Signals ..................................................................................................... 16
3.12
Test Interface Signals ................................................................................................................ 16
3.13
Power Supply Connections .......................................................................................................... 17
3.13.1
Digital and Analog Supplies .................................................................................................. 17
3.13.2
Grounds, Reserved Pins and No Connects ............................................................................... 17
4.0
5.0
5.1
5.2
5.2.1
5.2.2
5.3
6.0
6.1
6.2
6.3
6.4
6.4.1
6.4.2
6.4.3
6.4.4
7.0
8.0
9.0
9.1
9.2
Pinout/Signal Name
............................................................................................................... 18
Power Requirements
.............................................................................................................. 37
Targeted Absolute Maximum Ratings............................................................................................ 37
Targeted Recommended Operating Conditions ............................................................................... 38
General Operating Conditions................................................................................................ 38
Voltage Ramp and Sequencing Recommendations.................................................................... 38
Thermal Information .................................................................................................................. 40
Electrical Specification............................................................................................................
41
DC Specifications....................................................................................................................... 41
Resets ..................................................................................................................................... 45
Pull-up and Pull-down Specifications and Signals............................................................................ 46
Targeted AC Characteristics ........................................................................................................ 49
EEPROM Interface ............................................................................................................... 50
FLASH Interface .................................................................................................................. 51
NC-SI Interface................................................................................................................... 52
SMBus Interface.................................................................................................................. 53
Crystal Requirements
............................................................................................................. 55
LED Configuration
................................................................................................................... 56
Mechanical Information
.......................................................................................................... 57
Targeted Package Information..................................................................................................... 57
Pin Map.................................................................................................................................... 59
Intel
®
82575EB Gigabit Ethernet Controller
Datasheet
4
317679-004
Revision: 2.11
January 2011
Introduction — Intel
®
82575EB Gigabit Ethernet Controller
1.0
Introduction
The Intel
®
82575EB Gigabit Ethernet Controller is a single, compact component with two fully
integrated Gigabit Ethernet Media Access Control (MAC) and physical layer (PHY) ports. The device uses
the PCI Express Base Specification, Rev.1.1RD.
The 82575EB provides a standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and
10BASE-T applications (802.3z, 802.3u, and 802.3ab). Ports also contain a Serializer-Deserializer
(SERDES) to support 1000Base-SX/LX (optical fiber) and Gigabit backplane applications. In addition to
managing MAC and PHY Ethernet layer functions, the controller manages PCI Express packet traffic
across its transaction, link, and physical/logical layers. The SERDES can be used in SGMII mode to
connect to external PHY, either on-board or via the SFP connector.
The Intel 82575EB’s on-board System Management Bus (SMB) ports enable network manageability
implementations required by information technology personnel for remote control and alerting via the
LAN. With SMB, management packets can be routed to or from a management processor. Enhanced
pass-through capabilities also allow system remote control over standardized interfaces. Also included
is a new manageability interface, NC-SI that supports the DMTF preOS sideband protocol. An internal
management interface called MDIO enables the MAC (and software) to monitor and control the PHY.
Both ports support the Wake on LAN feature.
The 82575EB with PCI Express architecture is designed for high performance and low memory latency.
The device is optimized to connect to a system Memory Control Hub (MCH) using four PCI Express
lanes. Alternatively, the 82575EB can connect to an I/O Control Hub that has a PCI Express interface.
Wide internal data paths eliminate performance bottlenecks by efficiently handling large address and
data words. Combining a parallel and pipe-lined logic architecture optimized for Gigabit Ethernet and
independent transmit and receive queues, the 82575EB efficiently handles packets with minimum
latency. The 82575EB includes advanced interrupt handling features, including MSI-X support. The
82575EB uses efficient ring buffer descriptor data structures, with up to 64 packet descriptors cached
on chip. A large 48 KByte per port on-chip packet buffer maintains superior performance. In addition,
using hardware acceleration, the controller offloads tasks from the host, such as TCP/UDP/IP checksum
calculations and TCP segmentation.
The 82575EB operation can be configured using EEPROM and FLASH; it can be also be used in EEPROM-
less configurations.
The 82575EB is packaged in a 25mm X 25mm, 576-pin flip chip ball grid array (FCBGA).
1.1
Document Scope
This document contains targeted datasheet specifications for the 82575EB, including signal
descriptions, DC and AC parameters, packaging data, and pinout information.
317679-004
Revision: 2.11
January 2011
Intel
®
82575EB Gigabit Ethernet Controller
Datasheet
5
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