High Performance BGA Cooling
Solutions with maxiGRIP™ Attachment
ATS PART # ATS-53170G-C1-R0
Features & Benefits
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high aspect ratio, straight fin heat sinks that are ideal for compact pcB
environments
maxigrip™ attachment applies steady, even pressure to the
component and does not require holes in the pcB
Designed specifically for Bgas and other surface mount packages
meets telcordia gr-63-core office vibration, etsi 300 019
transportation vibration, and mil-stD-810 shock testing and
unpackaged Drop testing standards
comes preassembled with high performance, phase change, thermal
interface material
“keep-out” requirements: an “un-populated” boarder zone of 5
mm around the component is necessary to facilitate the installation/
removal of the maxigrip™. please refer to the maxigrip™ keep-
out guidelines and maxigrip™ installation/removal instructions for
further details
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thermal Performance
AIR VELOCITy
*Image above is for illustration purposes only.
THERMAL RESISTANCE
ft/min
200
300
400
500
600
700
800
m/s
1.0
1.5
2.0
2.5
3.0
3.5
4.0
°c/w (unDucteD flow)
13.1
10.4
9.0
8.1
7.4
6.9
6.5
°c/w (DucteD flow)
7.8
Product Details
DIMENSION A
17 mm
Notes:
1)
2)
3)
4)
5)
DIMENSION B
17 mm
DIMENSION C
12.5 mm
DIMENSION D
17 mm
INTERFACE MATERIAL
chomerics t766
FINISH
Blue anoDizeD
Dimensions are measureD in millimeters
Dimensions a & B refer to component size
Dimension c = the height of the heat sink shown aBove anD Does not
incluDe the height of the attachment methoD
ats reserves the right to upDate or change it proDucts without
notice
contact ats to learn aBout custom options availaBle
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
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