Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin
≤
R
≤
R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T
≤
max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number .................................................. CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number”
enter 110338-0-000
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content:
≤
900 ppm; Chlorine (Cl) content:
≤
900 ppm; Total Br + Cl content:
≤1500
ppm.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Applications
■
Overcurrent and overtemperature
■
Point-of-sale (POS) equipment
■
PCMCIA cards
■
USB port protection - USB 2.0, 3.0 & OTG
■
HDMI 1.4 Source protection
protection of automotive electronics
■
Hard disk drives
■
PC motherboards
■
PC peripherals
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see next page for outline drawings)
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
4.73
(0.186)
4.83
(0.190)
4.73
(0.186)
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
B
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
Min.
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.45
(0.018)
0.45
(0.018)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.70
(0.028)
0.48
(0.019)
C
Max.
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
0.85
(0.033)
1.60
(0.063)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
DIMENSIONS:
Style
1
1
1
1
1
1
1
1
1
1
2
1
1
2
1
1
2
1
MM
(INCHES)
Packaging:
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel.
MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Product Dimensions (see previous page for dimensions)
Style 1
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
2.7 ± 0.1
(.106 ± .004)
D
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
B
Style 2
Top View
Bottom View
A
Side View
C
Recommended Pad Layout
8
C
D
B
2.95 ± 0.10
(.114 ± .004)
1.68 ± 0.05
(.066 ± .002)
3.1 ± 0.10
(.122 ± .004)
Typical Time to Trip at 23 ˚C
100
MF-MSMF010
MF-MSMF200
10
MF-MSMF030
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
Time to Trip (Seconds)
1
MF-MSMF260
0.1
MF-MSMF160
MF-MSMF150
MF-MSMF125
0.01
MF-MSMF110
MF-MSMF075
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
MF-MSMF110/16
0.001
0.1
1
MF-MSMF050
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
MF-MSMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold (Amps)
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
-40 ˚C
0.16
0.23
0.29
0.29
0.44
0.77
1.15
1.15
1.59
1.59
2.00
1.80
2.17
2.10
2.30
3.08
3.90
4.00
-20 ˚C
0.14
0.19
0.26
0.26
0.39
0.68
1.01
1.01
1.43
1.43
1.70
1.63
1.95
1.90
2.20
2.71
3.42
3.52
0 ˚C
0.12
0.17
0.23
0.23
0.35
0.59
0.88
0.88
1.26
1.26
1.40
1.43
1.72
1.70
1.90
2.35
2.96
3.06
Ambient Operating Temperature
23 ˚C
40 ˚C
50 ˚C
0.10
0.08
0.07
0.14
0.12
0.10
0.20
0.17
0.15
0.20
0.17
0.15
0.30
0.26
0.23
0.50
0.44
0.40
0.75
0.65
0.60
0.75
0.65
0.60
1.10
0.95
0.87
1.10
0.95
0.87
1.10
0.95
0.88
1.25
1.08
0.99
1.50
1.30
1.18
1.50
1.25
1.13
1.60
1.45
1.30
2.00
1.80
1.60
2.50
2.24
1.98
2.60
2.34
2.08
60 ˚C
0.06
0.09
0.14
0.14
0.21
0.37
0.55
0.55
0.80
0.80
0.80
0.91
1.09
1.00
1.15
1.50
1.85
1.95
70 ˚C
0.05
0.08
0.12
0.12
0.18
0.33
0.49
0.49
0.71
0.71
0.73
0.81
0.97
0.88
1.03
1.40
1.29
1.39
85 ˚C
0.03
0.06
0.10
0.10
0.15
0.29
0.43
0.43
0.60
0.60
0.61
0.68
0.82
0.69
0.91
1.25
0.94
1.04
Solder Reflow Recommendations
300
250
Temperature (°C)
200
150
Preheating
Soldering
Cooling
Notes:
•
•
•
MF-MSMF models cannot be wave soldered. Please contact Bourns for
hand soldering recommendations.
If reflow temperatures exceed the recommended profile, devices may
not meet the performance requirements.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC product soldering
recommendation guidelines.
100
50
0
160–220
10–20
Time (seconds)
120
•
How to Order
Typical Part Marking
MF - MSMF 075/24 - 2
Multifuse
®
Product
Designator
Series
MSMF = 4532 mm (1812 mils)
Surface Mount Component
Hold Current, Ihold
010-260 (0.10 Amps - 2.60 Amps)
Higher Voltage Option
__ = Standard Voltage
/16 = 16 Volt Rated
/24 = 24 Volt Rated
/60 = 60 Volt Rated
X=
Multifuse
®
freeXpansion Design
™
MF-MSMF Series
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Represents total content. Layout may vary.
BI-WEEKLY DATE CODE:
WEEKS 49-50 = Y
YEAR CODE:
5 = 2005
PART IDENTIFICATION EXAMPLES:
MF-MSMF050 = 50
MF-MSMF075 = 75
MF-MSMF110 = 11
MF-MSMF150 = 15
PART IDENTIFICATION EXAMPLES:
MF-MSMF110/24X = 6
MF-MSMF150/24X = 8
MF-MSMF250/16X = C
BI-WEEKLY DATE CODE:
WEEKS 5-6 = C
115Y
8
C
MF-MSMF SERIES, REV. AD, 02/13
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual
device performance may vary over time.
MF-MSMF Series Tape and Reel Specifications
MF-MSMF010 -
MF-MSMF030
per EIA-481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.58 ± 0.10
(0.141 ± 0.004)
4.93 ± 0.10
(0.194 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
1.30 ± 0.10
(0.051 ± 0.004)
390
(15.35)
160
(6.30)
MF-MSMF050 -
MF-MSMF260
per EIA 481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.66 ± 0.15
(0.144 ± 0.006)
4.98 ± 0.10
(0.196 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
0.95 ± 0.10
(0.037 ± 0.004)
390
(15.35)
160
(6.30)
MF-MSMF-110/24X
MF-MSMF150/24X
MF-MSMF250/16X
per EIA 481-1
12.0 ± 0.30
(0.472 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.70 ± 0.10
(0.146 ± 0.004)
5.10 ± 0.10
(0.200 ± 0.004)
5.9
(0.232)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
5.5 ± 0.05
(0.217 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
10.25
(0.404)
0.6
(0.024)
0.1
(0.004)
1.50 ± 0.10
(0.059 ± 0.004)
390
(15.35)
160
(6.30)
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
P0
T
D0
P2
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
185
(7.28)
50
(1.97)
12.4 + 2.0/-0.0
(0.488 + 0.079/-0.0)
18.4
(0.724)
DIMENSIONS:
MM
(INCHES)
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
B1
B0
K0
T1
P1
A0
W1(MEASURED
AT HUB)
E2 W
A
N(HUB DIA.)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
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51mcu
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