MBM27C256-45Z datasheet, PDF - EEWORLD Datasheet

MBM27C256-45Z: DescriptionEPROM, 32KX8, 450ns, CMOS, CDIP28; Categorystorage storage; File Size211KB，6 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MBM27C256-45Z Overview

EPROM, 32KX8, 450ns, CMOS, CDIP28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	FUJITSU
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
Maximum access time	450 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
memory density	262144 bit
memory width	8
Number of terminals	28
word count	32768 words
character code	32000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Programming voltage	21 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MBM27C256-45Z	MBM27C256-25	MBM27C256-30Z
Description	EPROM, 32KX8, 450ns, CMOS, CDIP28	32KX8 UVPROM, 250ns, CQCC32, METAL SEALED, CERAMIC, LCC-32	UVPROM, 32KX8, 300ns, CMOS, CDIP28, CERDIP-28
package instruction	DIP, DIP28,.6	WQCCN,	WDIP,
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	450 ns	250 ns	300 ns
JESD-30 code	R-XDIP-T28	R-CQCC-N32	R-GDIP-T28
memory density	262144 bit	262144 bit	262144 bit
memory width	8	8	8
Number of terminals	28	32	28
word count	32768 words	32768 words	32768 words
character code	32000	32000	32000
Maximum operating temperature	70 °C	70 °C	70 °C
organize	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	WQCCN	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER, WINDOW	IN-LINE, WINDOW
Certification status	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL
Maker	FUJITSU	FUJITSU	-
Parts packaging code	DIP	QFJ	-
Contacts	28	32	-
ECCN code	-	EAR99	EAR99
length	-	13.97 mm	37.275 mm
Memory IC Type	-	UVPROM	UVPROM
Number of functions	-	1	1
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS
Parallel/Serial	-	PARALLEL	PARALLEL
Maximum seat height	-	3.3 mm	5.84 mm
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	4.5 V	4.5 V
width	-	11.43 mm	15.24 mm

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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