CY8C20xx7S datasheet, PDF - EEWORLD Datasheet

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CY8C20xx7S: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, QCC16; Categorysemiconductor The embedded processor and controller; File Size651KB，43 Pages; ManufacturerCypress Semiconductor

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CY8C20xx7S Overview

SPECIALTY MICROPROCESSOR CIRCUIT, QCC16

CY8C20xx7S Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	1.71 V
Rated supply voltage	3.3 V
Processing package description	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
Craftsmanship	CMOS
packaging shape	SQUARE
Package Size	CHIP CARRIER, VERY THIN PROFILE
surface mount	Yes
Terminal form	NO LEAD
Terminal spacing	0.5000 mm
terminal coating	NICKEL PALLADIUM GOLD
Terminal location	QUAD
Packaging Materials	UNSPECIFIED
Temperature level	INDUSTRIAL
Microprocessor type	MICROPROCESSOR CIRCUIT

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CY8C20xx7/S

1.8 V CapSense

Controller with

SmartSense™ Auto-tuning

31 Buttons, 6 Sliders, Proximity Sensors

1.8 V CapSense

Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors

Features

■

QuietZone™ Controller

❐

Patented Capacitive Sigma Delta PLUS (CSD PLUS™)

sensing algorithm for robust performance

❐

High Sensitivity (0.1 pF) and best-in-class SNR performance

to support:

• Overlay thickness of 15 mm for glass and 5 mm plastic

• Proximity Solutions

❐

Superior noise immunity performance against conducted and

radiated noise and ultra low radiated emissions

• Standardized user modules for overcoming noise

Low power CapSense

block with SmartSense Auto-tuning

❐

Low average power consumption –

• 28 µA/sensor in run time (wake-up and scan once every

125 ms)

❐

SmartSense_EMC_PLUS Auto-Tuning

• Sets and maintains optimal sensor performance during run

time

• Eliminates system tuning during development and

production

• Compensates for variations in manufacturing process

Driven shield available on five GPIO pins

❐

Delivers best-in class water tolerant designs

❐

Robust proximity sensing in the presence of metal objects

❐

Supports longer trace lengths

❐

Max load of 100 pF (3 MHz)

Powerful Harvard-architecture processor

❐

M8C CPU with a max speed of 24 MHz

Operating Range: 1.71 V to 5.5 V

❐

Standby Mode 1.1

μA

(Typ)

❐

Deep Sleep 0.1

μA

(Typ)

Operating Temperature range: –40

C to +85

Flexible on-chip memory

❐

8 KB flash, 1 KB SRAM

❐

16 KB flash, 2 KB SRAM

❐

32 KB flash, 2 KB SRAM

❐

50,000 flash erase/write cycles

❐

Read while Write with EEPROM emulation

❐

In-system programming simplifies manufacturing process

4 Clock Sources

❐

Internal main oscillator (IMO): 6/12/24 MHz

❐

Internal low-speed oscillator (ILO) at 32 kHz for watchdog

and sleep timers

❐

External 32 KHz Crystal Oscillator

❐

External Clock Input

Programmable pin configurations

❐

Up to 34 general-purpose I/Os (GPIOs)

❐

Dual mode GPIO (Analog and Digital)

❐

High sink current of 25 mA per GPIO

• Max sink current 120 mA for all I/Os combined

❐

Source Current

• 5 mA on ports 0 and 1

• 1 mA on ports 2,3 and 4

❐

Configurable internal pull-up, high-Z and open drain modes

❐

Selectable, regulated digital I/O on port 1

❐

Configurable input threshold on port 1

Versatile Analog functions

❐

Internal analog bus supports connection of multiple sensors

to form ganged proximity sensor

❐

Internal Low-Dropout voltage regulator for high power supply

rejection ratio (PSRR)

Additional system resources

❐

I C Slave:

• Selectable to 50 kHz, 100 kHz, or 400 kHz

• Selectable Clock stretch or Forced Nack Mode

• I

C wake from sleep with Hardware address match

❐

12 MHz (Configurable) SPI master and slave

❐

Three 16-bit timers

❐

Watchdog and sleep timers

❐

Integrated supervisory circuit

❐

10-bit incremental analog-to-digital converter (ADC) with

internal voltage reference

❐

Two general-purpose high speed, low power analog

comparators

Complete development tools

❐

Free development tool (PSoC Designer™)

Sensor and Package options

❐

10 Sensing Inputs – 16-pin QFN, 16-pin SOIC

❐

16 Sensing Inputs – 24-pin QFN

[1]

❐

24 Sensing Inputs – 30-pin WLCSP

❐

25 Sensing Inputs – 32-pin QFN

❐

31 Sensing Inputs – 48-pin QFN

■

Note

1. Please contact your nearest sales office for additional details.

Cypress Semiconductor Corporation

Document Number: 001-69257 Rev. *I

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised May 7, 2013

CY8C20xx7S Related Products

	CY8C20xx7S	CY8C20247/S-24LKXI	CY8C20247/S-24LKXIT	CY8C20247/S-24SXI	CY8C20247S-24SXI	CY8C20767-24FDXC	CY8C20XX7
Description	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16	SPECIALTY MICROPROCESSOR CIRCUIT, QCC16
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel	85 Cel
Minimum operating temperature	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel	-40 Cel
Maximum supply/operating voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply/operating voltage	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
Rated supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Processing package description	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16	3 X 3 MM, 0.60 MM HEIGHT, LEAD FREE, MO-220, QFN-16
Lead-free	Yes	Yes	Yes	Yes	Yes	Yes	Yes
EU RoHS regulations	Yes	Yes	Yes	Yes	Yes	Yes	Yes
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Craftsmanship	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal spacing	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm	0.5000 mm
terminal coating	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Packaging Materials	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Microprocessor type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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