UPD703079AYGC(A)-XXX-8EU datasheet, PDF - EEWORLD Datasheet

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UPD703079AYGC(A)-XXX-8EU: DescriptionIC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，587 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD703079AYGC(A)-XXX-8EU Overview

IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC

UPD703079AYGC(A)-XXX-8EU Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
Contacts	100
Reach Compliance Code	unknown
Has ADC	YES
Address bus width	22
bit size	32
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
Number of I/O lines	84
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	235
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	16 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	3.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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User’s Manual

V850/SF1

32-Bit Single-Chip Microcontroller

Hardware

µ

PD703075AY

µ

PD703075AY(A)

µ

PD703076AY

µ

PD703076AY(A)

µ

PD703078AY

µ

PD703078AY(A)

µ

PD703078Y

µ

PD703079AY

µ

PD703079AY(A)

µ

PD703079Y

Document No. U14665EJ4V0UD00 (4th edition)

Date Published September 2003 N CP(K)

2000, 2003

Printed in Japan

µ

PD70F3079AY

µ

PD70F3079AY(A)

µ

PD70F3079Y

NOTES FOR CMOS DEVICES

1

PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note:

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

2

HANDLING OF UNUSED INPUT PINS FOR CMOS

Note:

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided

to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to V

DD

or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

3

STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note:

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does

not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

User’s Manual U14665EJ4V0UD

3

Purchase of NEC Electronics I

2

C components conveys a license under the Philips I

2

C Patent Rights to use

these components in an I

2

C system, provided that the system conforms to the I

2

C Standard Specification as

defined by Philips.

These commodities, technology or software, must be exported in accordance

with the export administration regulations of the exporting country.

Diversion contrary to the law of that country is prohibited.

•

The information in this document is current as of September, 2003. The information is subject to

change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

all products and/or types are available in every country. Please check with an NEC Electronics sales

representative for availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without the prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

appear in this document.

•

NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from the use of NEC Electronics products listed in this document

or any other liability arising from the use of such products. No license, express, implied or otherwise, is

granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of a customer's equipment shall be done under the full

responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by

customers or third parties arising from the use of these circuits, software and information.

•

While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,

customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To

minimize risks of damage to property or injury (including death) to persons arising from defects in NEC

Electronics products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment and anti-failure features.

•

NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and

"Specific".

The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-

designated "quality assurance program" for a specific application. The recommended applications of an NEC

Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of

each NEC Electronics product before using it in a particular application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots.

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support).

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC

Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications

not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to

determine NEC Electronics' willingness to support a given application.

(Note)

(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its

majority-owned subsidiaries.

(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as

defined above).

M8E 02. 11-1

4

User’s Manual U14665EJ4V0UD

UPD703079AYGC(A)-XXX-8EU Related Products

	UPD703079AYGC(A)-XXX-8EU	UPD703076AYGC(A)-XXX-8EU	UPD703078AYGC(A)-XXX-8EU
Description	IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,100PIN,PLASTIC	UPD703078AYGC(A)-XXX-8EU
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	QFP	QFP	LFQFP
Contacts	100	100	100
Reach Compliance Code	unknown	unknown	unknown
Has ADC	YES	YES	YES
Address bus width	22	22	22
bit size	32	32	32
maximum clock frequency	16 MHz	16 MHz	16 MHz
DAC channel	NO	NO	NO
DMA channel	YES	YES	YES
External data bus width	16	16	16
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0	e0
length	14 mm	14 mm	14 mm
Number of I/O lines	84	84	84
Number of terminals	100	100	100
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	235	235	235
Certification status	Not Qualified	Not Qualified	Not Qualified
ROM programmability	MROM	MROM	MROM
Maximum seat height	1.6 mm	1.6 mm	1.6 mm
speed	16 MHz	16 MHz	16 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	3.5 V	3.5 V	3.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30
width	14 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Is it lead-free?	Contains lead	Contains lead	-

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