Inductor for Power Lines (Power Inductor)
1. Standard Land Pattern Dimensions
Soldering and Mounting
A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip
inductor (chip coil) electrode.
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
Series
Standard Land Dimensions
Part Number
LQM18F
Flow
/18P
Reflow
LQM21D/21F/21P
LQM2MP
LQM2HP
LQM31P
LQM32P
c
LQM18F/18P
LQM21D/21F/21P
LQM2MP
LQM2HP
LQM31P
LQM32P
LQH2MC
LQH31C
LQH32P
LQH44P
LQH5BP
LQH55D/66S
LQW15C_00
LQW15C_10
LQW18C
a
0.7
1.2
0.8
1.6
2.0
1.9
0.8
1.0
1.3
1.3
1.8
2.0
0.4
0.4
0.7
b
2.2-2.6
1.8-2.0
3.0-4.0
2.4
3.0
4.2-5.2
3.6
2.6
4.5
3.8
4.4
5.5
8.0
1.4
1.4
2.2
c
0.7
1.0
1.8
1.5
1.2
2.7
1.0
1.5
2.0
3.0
4.1
3.5
0.6
0.66
1.0
LQH2MC
LQH31C
a
b
LQH32P
LQH44P
LQH5BP
LQH55D/66S
LQW15C_00
LQW15C_10
LQW18C
0.8
3.0
LQH32C
2.0
1.0
5.5
1.0 1.3 1.0
LQH3NP
0.75
0.7
0.45
2.4
0.7
0.45
3.3
0.75
1.15
1.0
3.3
1.15
LQH43C
LQH43P
3.0
1.5
7.5
1.5 1.5 1.5
45˚
LQH55P
1.
6
Continued on the following page.
Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator.
1.4
LQH2HP
2.
9
6.
7
Inductor for Power Lines (Power Inductor)
Soldering and Mounting
2. Standard Soldering Conditions
(1) Soldering method
Chip inductor (Chip coils) can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S,
LQM32P, LQW15C/18C series, please use reflow
soldering.
(2) Soldering profile
"Flow
Soldering profile
(Sn-3.0Ag-0.5Cu solder)
Temperature (°C)
T3
T2
t2
Heating
Limit Profile
Standard Profile
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux: Use rosin-based flux, but not strongly acidic flux (with
chlorine content exceeding 0.2wt%).
Do not use water-soluble flux.
The flux used for LQW15C/18C series should use the
rosin-based flux that includes middle activator
equivalent to 0.06wt% to 0.1wt% chlorine.
For additional mounting methods, please contact Murata.
T1
Pre-heating
t1
time (s)
Series
Pre-heating
Temp. (T1)
Time. (t1)
Standard Profile
Heating
Temp. (T2)
Time. (t2)
Cycle
of flow
Limit Profile
Heating
Temp. (T3)
Time. (t2)
Cycle
of flow
LQM18F/18P
LQM21D/21F/21P/2MP/2HP
LQM31P
LQH31C
LQH32C
LQH43C/43P
150°C
60s min.
250°C
4 to 6s
2 times
max.
265±3°C
5s max.
2 times
max.
150°C
60s min.
250°C
4 to 6s
2 times
max.
265±3°C
5s max.
1 times
"Reflow
Soldering profile
(Sn-3.0Ag-0.5Cu solder)
T4
Temperature (°C)
T2
T1
180
150
Limit Profile
Pre-heating
t1
Standard Profile
t2
90±30s
time (s)
T3
Standard Profile
Series
Heating
Temp. (T1)
Time. (t1)
Peak
temperature
(T2)
Cycle
of reflow
Heating
Temp. (T3)
Limit Profile
Peak
temperature
(T4)
Cycle
of reflow
Time. (t2)
LQM18F/18P
LQM21D/21F/21P/2MP/2HP
LQM31P/32P
LQH2MC, LQH2HP
LQH31C
LQH3NP/32P/43P/44P/5BP/55P
LQW15C/18C
LQH32C
LQH43C
LQH55D, LQH66S
220°C
30 to 60s
245±3°C
2 times
max.
230°C
60s max.
260°C/10s
2 times
max.
220°C
30 to 60s
245±3°C
2 times
max.
230°C
60s max.
260°C/10s
1 time
Continued on the following page.
Inductor for Power Lines (Power Inductor)
Soldering and Mounting
(3) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directly touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows:
3. Mounting Instructions
(1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown) cause floating and
electrode leaching.
(2) Land Pattern Designing (LQH series)
Please follow the recommended patterns.
Otherwise, their performance which includes electrical
performance or solderability may be affected, or result to
“position shift” in soldering process.
(3) Magnetic Coupling
Since some chip inductors (chip coils) are constructed
like an open magnetic circuit, narrow spacing between
inductors (coils) may cause magnetic coupling.
LQM, LQH66S and LQH_P series have a magnetically
shielded structure. The structure makes their coupling
coefficient smaller than that of conventional chip
inductors (chip coils).
(4) PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Soldering iron power output: 80W max.
Temperature of soldering iron tip: 350°C
Diameter of soldering iron end: 3.0mm max.
Soldering time: within 3 s
Land
Solder Resist
c
d
Magnetic Coupling
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
a
b
Poor example
except LQH3NP/44P/5BP
Good example
The electrode part of the product should be located
like the picture to the mechanical stress.
electrode
Poor example
LQH3NP/44P/5BP
electrode
Good example
Continued on the following page.
Inductor for Power Lines (Power Inductor)
Soldering and Mounting
(5) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste as shown on the right
so that solder is applied.
"
Guideline of solder paste thickness
· LQW15C: 50 to 100μm
· LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P,
LQH44P/5BP/55P: 100 to 150μm
· LQH31C/32C, LQH43C/43P, LQH55D,
LQH66S: 200 to 300μm
(6) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the conditions shown in
chart.
LQH_C/D/H/N/P
LQH_S
LQM
LQW_C
LQH_C/H/M/N
LQM
Typical Application Amount (in:mg)
IR-100
0.06-0.07
0.20-0.25
0.25-0.30
0.20-0.25
0.27-0.35
0.60-0.80
Part Number
LQM18F/18P
LQM21D/21F/21P/2MP
LQM2HP/31P
LQH31C
LQH32C
LQH43C
4. Cleaning
The following conditions should be observed when
cleaning chip inductors (chip coils):
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol cleaning agents)
(2) Ultrasonic
Output: 20W/l max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
Care should be taken not to cause resonance of the
PCB and mounted products.
(3) Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
(a) Alcohol cleaning agents
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agents
Pine Alpha ST-100S
LQH66S series: Aqueous agents should not be used
because they may cause quality deterioration or
damage to appearance.
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact Murata.
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