TS75C32
V.32, V.22bis, V.22, V.23, V.21,
BELL 212A, BELL 103 MODEM CHIP SET
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ADVANCE DATA
CCITT V.32, V22bis, V.22, V.21, V.23,
Bell 212A, Bell 103 COMPATIBLE MODEM
CHIP SET
INTEGRATED IMPLEMENTATION ON THREE
DSP AND THREE MAFE CHIPS
FULL DUPLEX OPERATION FROM 9600 TO
300BPS
FULL IMPLEMENTATION OF THE V.32 AND
V.22bis HANDSHAKE
DYNAMIC RANGE : 43dB
TWO SATELLITE HOPS AND FREQUENCY
OFFSET CAPABILITIES (10Hz) FOR THE
FAR END ECHO CANCELLER IN V.32 MODE
TRELLIS ENCODING AND VITERBI DECOD-
ING
12.5% ROLL-OFF RAISED COSINE TRANS-
MITTER PULSE SHAPING
HIGH PERFORMANCE PASSBAND FRAC-
TIONALLY SPACED ADAPTIVE EQUALIZER
SIGNAL QUALITY MONITORING
PARALLEL INTERFACE TO STANDARD MI-
CROPROCESSORS
BIT RATE DATA CLOCKS PROVIDED FOR
SYNCHRONOUS DATA TRANSFER
FULL DIAGNOSTIC CAPABILITY
DTMF GENERATION
CALL PROGRESS TONE DETECTION
SOFTWARE LICENSE AND DEVELOPMENT
TOOLS AVAILABLE FOR EASY CUSTOMIZA-
TION
TOTAL POWER CONSUMPTION BELOW 2W
DIP24
(Plastic Package)
DIP28
(Plastic Package)
DIP48
(Plastic Package)
PLCC28
(Plastic Chip Carrier)
PLCC52
(Plastic Chip Carrier)
DESCRIPTION
The SGS-THOMSON Microelectronics TS75C32
chip set is a highly integratedmodem engine,which
can operate in full duplex from 9600 to 300bps. The
modem hardware consists of three analog front
end (MAFE) chips, three DSP processor chips and
additional memory chips.
The three SGS-THOMSON analog front end chips
(TS68950/1/2) are the transmit interface, the re-
ceive interface and the clock generator respec-
tively.
The modem signal processing functions are imple-
mented on three ST18930 programmable digital
signal processors.
February 1995
ORDER CODES
Part Number
TS75C320CP
TS75C321CP
TS75C322CP
TS68950CP
TS68951CP
TS68952CP
TS75C320CFN
TS75C321CFN
TS75C322CFN
TS68950CFN
TS68951CFN
TS68952CFN
Temperature
Range
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
Package
DIP48
DIP48
DIP48
DIP24
DIP28
DIP28
PLCC52
PLCC52
PLCC52
PLCC28
PLCC28
PLCC28
1/40
This is advance information on a new product now in development or undergoing evaluation. Details are subject to change without no tice.
75C32-01.TBL
TS75C32
PIN DESCRIPTION
Pin
Name
Type
Signal
Name
Description
SYSTEM INTERFACE
TS75C321
(DSP#1 Transmitter and Handshake)
AD0.AD7
CS
RS
SDS
SR/W
IRQ
RESET
I/O
I
I
I
I
O
I
D0H.D7H
CSL
RSL
DSL
RWL
INTL
RSTL1
System Data Bus : these lines are used for data transfer between the TS75C32
mailbox and the host processor
Chip Select : this input is asserted when the TS75C32 is to be accessed by the
host processor
Register Select : this signal is used to control the data transfers between the
host processor and the TS75C32 mailbox
System Data Strobe : synchronizes the transfer between the TS75C32 mailbox
and the host processor
System Read/Write : control signal for the TS75C32 mailbox operation
Interrupt Request : signal sent to the host processor to access the TS75C32
mailbox
Master Reset of DSP#1
ANALOG INTERFACE
TS68950
(Analog Front End Transmitter)
ATO
O
ATO
Analog Transmit Output
TS68951
(Analog Front End Receiver)
RAI
LEI
I
I
RAI
LEI
Receive Analog Input
Local Echo Input. Must be grounded.
CLOCK INTERFACE
TS68952
(Clock Generator)
TxCLK
TxRCLK
TxCCLK
TxMCLK
RxCLK
RxRCLK
RxCCLK
RxMCLK
TxSCLK
O
O
O
O
O
O
O
O
I
TxCLK
TxRCLK
TxCCLK
TxMCLK
RxCLK
RxRCLK
RxCCLK
RxMCLK
TxSCLK
Transmit Bit Clock
Transmit Baud Clock
Transmit Conversion Clock
Transmit Multiplex Clock
Receive Bit Clock
Receive Baud Clock
Receive Conversion Clock
Receive Multiplex Clock
Transmit Synchro Clock : can be used to synchronize the trans-
mitter on an external bit clock provided by the RS232C (or V.24) junction
75C32-02.TBL
4/40
TS75C32
ABSOLUTE MAXIMUM RATINGS
Symbol
TS75C320/1/2
V
CC
(1)
V
IN
(1)
T
oper
T
stg
TS68950/1/2
Supply Voltage between V + and AGND or DGND
Supply Voltage between V - and AGND or DGND
Voltage between AGND and DGND
Digital Input Voltage
Digital Output Voltage
Digital Output Current
Analog Input Voltage
Analog Output Voltage
Analog Output Current
P
tot
T
oper
T
stg
Power Dissipation
Operating Temperature
Storage Temperature
-
Parameter
Value
Unit
Supply Voltage
Input Voltage
Operating Temperature
Storage Temperature
– 0.3, + 7.0
– 0.3, + 7.0
0, + 70
– 55, + 150
V
V
°C
°C
– 0.3, + 7
– 7, + 0.3
– 0.3, + 0.3
DGND – 0.3, V
CC+
+ 0.3
DGND – 0.3, V
CC
+ 0.3
– 20, + 20
V
CC-
– 0.3, V
CC+
+ 0.3
V
CC
– 0.3, V
CC
+ 0.3
– 10, + 10
500
0, + 70
– 65, + 150
+
+
V
V
V
V
V
mA
V
V
mA
°C
°C
75C32-03.TBL
75C32-04.TBL
mW
Notes :
1. With respect to V
SS
.
2. Stresses above those hereby listed may cause permanent damage to the device. The ratings are stress ones only and functional
operation of the device at these or any conditions beyond those indicated in the operational sections of this specification is not
implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Standard MOS circuits hand-
ling procedure should be used to avoid possible damage to the device.
DC ELECTRICAL CHARACTERISTICS
(DGND = AGND = 0V)
Symbol
Parameter
Min.
Typ.
Max.
Unit
DIGITAL SUPPLY (V
CC
= 5.0V
±10%,
V
SS
= 0, T
amb
= 0 to +70
o
C, unless otherwise specified)
V
CC
V
IL
V
IH
I
i
I
in
V
OH
V
OL
P
D
C
in
I
TSI
V
+
V
–
I
I
+
–
Supply Voltage
Input Low Voltage
Input High Voltage
Input Extal Current
Input Leakage Current
Output High Voltage (I
load
= – 300µA)
Output Low Voltage (I
load
= 3.2mA)
Total Power Dissipation
Input Capacitance
Three State (off state) Input Current
4.5
– 0.3
2.4
– 50
– 10
2.7
5
5.5
0.8
V
CC
+ 50
10
0.5
V
V
V
µA
µA
V
V
W
pF
1.5
10
– 20
– 20
ANALOG SUPPLY
Positive Power Supply
Negative Power Supply
Positive Supply Current
Negative Supply Current
– 35
4.75
– 5.25
5.25
– 4.75
35
V
V
mA
Note :
Case Temperature T
C
must be maintened below 100
o
C.
5/40
Embedded System
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