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TS75C961CP-S

Description
9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48
CategoryWireless rf/communication    Telecom circuit   
File Size509KB,47 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

TS75C961CP-S Overview

9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48

TS75C961CP-S Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionPLASTIC, DIP-48
Contacts48
Reach Compliance Codenot_compliant
Other featuresDATA RATE MIN:300BPS
data rate9.6 Mbps
JESD-30 codeR-PDIP-T48
JESD-609 codee0
Number of functions1
Number of terminals48
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountNO
Telecom integrated circuit typesMODEM
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
TS75C96
V.32, V.29, V.27ter, V.22bis, V.22, V.23,
BELL 212A, BELL 103 MODEM CHIP SET
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ADVANCE DATA
CCITT V.32, V.22bis, V.22, V.21, V.23,
Bell 212A, Bell 103 COMPATIBLE MODEM
CHIP SET
CCITT V.29, V.27ter FOR FAX APPLICA-
TIONS
INTEGRATED IMPLEMENTATION ON THREE
DSP AND THREE MAFE CHIPS
FULL DUPLEX OPERATION FROM 9600 TO
300bps
FULL IMPLEMENTATION OF THE V.32 AND
V.22bis HANDSHAKE
V.29/4800bps AND V.27ter SHORT TRAIN SE-
QUENCES
DYNAMIC RANGE : 43dB
TWO SATELLITE HOPS AND FREQUENCY
OFFSET CAPABILITIES (10Hz) FOR THE
FAR END ECHO CANCELLER IN V.32 MODE
TRELLIS ENCODING AND VITERBI DECOD-
ING
12.5% ROLL-OFF RAISED COSINE TRANS-
MITTER PULSE SHAPING
HIGH PERFORMANCE PASSBAND FRAC-
TIONALLY SPACED ADAPTIVE EQUALIZER
SIGNAL QUALITY MONITORING
PARALLEL INTERFACE TO STANDARD MI-
CROPROCESSORS
SERIAL DATA TRANSMIT CAPABILITY
V.14 AND V.54 IMPLEMENTATION
LOW POWER MODE AVAILABLE (PLCC)
BIT RATE DATA CLOCKS PROVIDED FOR
SYNCHRONOUS DATA TRANSFER
FULL DIAGNOSTIC CAPABILITY
DTMF GENERATION
CALL PROGRESS TONE DETECTION
PROGRAMMABLE FILTERS FOR ”AUTO-
BAUD” IMPLEMENTATION
SOFTWARE LICENSE AND DEVELOPMENT
TOOLS AVAILABLE FOR EASY CUSTOMIZA-
TION
TOTAL POWER CONSUMPTION BELOW
1.5W
DESCRIPTION
The SGS-THOMSON Microelectronics TS75C96
chip set is a highly integrated modem engine, which
can operate in full duplex from 9600 to 300bps. The
modem hardware consists of three analog front
end (MAFE) chips, three DSP processor chips and
additionalmemory chips plus the V.14 serial output
converter.The three SGS-THOMSON analog front
end chips (TS68950/1/2)are the transmit interface,
the receive interface and the clock generator re-
spectively.The modem signal processing functions
are implemented on three ST18930 programmable
digital signal processors.
DIP24
(Plastic Package)
DIP28
(Plastic Package)
DIP48
(Plastic Package)
PLCC28
(Plastic Chip Carrier)
PLCC52
(Plastic Chip Carrier)
See Order Codes on Page 4
February 1995
This is advance information on a new product now in development or undergoing evaluation. Details are subject to change without no tice.
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Description 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48 9.6kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28, PLASTIC, DIP-28 MODEM-SUPPORT CIRCUIT, PDIP24, PLASTIC, DIP-24 9.6kbps DATA, MODEM, PQCC52, PLASTIC, LCC-52 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48 9.6kbps DATA, MODEM, PQCC52, PLASTIC, LCC-52 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP LCC DIP LCC DIP
package instruction PLASTIC, DIP-48 PLASTIC, DIP-28 PLASTIC, DIP-24 PLASTIC, LCC-52 PLASTIC, DIP-48 PLASTIC, LCC-52 PLASTIC, DIP-48
Contacts 48 28 24 52 48 52 48
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 code R-PDIP-T48 R-PDIP-T28 R-PDIP-T24 S-PQCC-J52 R-PDIP-T48 S-PQCC-J52 R-PDIP-T48
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of functions 1 1 1 1 1 1 1
Number of terminals 48 28 24 52 48 52 48
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP QCCJ DIP QCCJ DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES NO YES NO
Telecom integrated circuit types MODEM MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM MODEM MODEM MODEM
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL QUAD DUAL QUAD DUAL
width 15.24 mm 15.24 mm 15.24 mm 19.1262 mm 15.24 mm 19.1262 mm 15.24 mm
Maker STMicroelectronics - - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Other features DATA RATE MIN:300BPS DATA RATE MIN:300BPS - DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS
data rate 9.6 Mbps 9.6 Mbps - 9.6 Mbps 9.6 Mbps 9.6 Mbps 9.6 Mbps
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