Telecom IC, CMOS, PDIP40,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | CONEXANT |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | compliant |
| Carrier type | CEPT PCM-30/E-1 |
| Carrier Type (2) | T-1(DS1) |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.04 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| BTP9170KP | BTP9170KPJ | |
|---|---|---|
| Description | Telecom IC, CMOS, PDIP40, | Framer, CMOS, PQCC44, PLASTIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | CONEXANT | CONEXANT |
| Parts packaging code | DIP | LCC |
| package instruction | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ |
| Contacts | 40 | 44 |
| Reach Compliance Code | compliant | compliant |
| Carrier type | CEPT PCM-30/E-1 | CEPT PCM-30/E-1 |
| Carrier Type (2) | T-1(DS1) | T-1(DS1) |
| JESD-30 code | R-PDIP-T40 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 40 | 44 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | LDCC44,.7SQ |
| Package shape | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 0.04 mA | 0.04 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD |