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BUL54ASMD-QR-B

Description
2A, 500V, NPN, Si, POWER TRANSISTOR, CERAMIC, SMD1, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size21KB,2 Pages
ManufacturerSEMELAB
Download Datasheet Parametric Compare View All

BUL54ASMD-QR-B Overview

2A, 500V, NPN, Si, POWER TRANSISTOR, CERAMIC, SMD1, 3 PIN

BUL54ASMD-QR-B Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSEMELAB
package instructionCHIP CARRIER, R-CBCC-N3
Contacts3
Reach Compliance Codecompliant
Shell connectionCOLLECTOR
Maximum collector current (IC)2 A
Collector-emitter maximum voltage500 V
ConfigurationSINGLE
Minimum DC current gain (hFE)5
JESD-30 codeR-CBCC-N3
Number of components1
Number of terminals3
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Nominal transition frequency (fT)20 MHz
BUL54ASMD
MECHANICAL DATA
Dimensions in mm
0 .8 9
(0 .0 3 5 )
m in .
3 .7 0 (0 .1 4 6 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
3 .4 1 (0 .1 3 4 )
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
ADVANCED
DISTRIBUTED BASE DESIGN
HIGH VOLTAGE
HIGH SPEED NPN
SILICON POWER TRANSISTOR
3 .6 0 (0 .1 4 2 )
M a x .
1
3
2
• SEMEFAB DESIGNED AND DIFFUSED DIE
• HIGH VOLTAGE
• FAST SWITCHING (t
f
= 40ns)
• EXCEPTIONAL HIGH TEMPERATURE
PERFORMANCE
• HIGH ENERGY RATING
• EFFICIENT POWER SWITCHING
• MILITARY AND HI–REL OPTIONS
0 .7 6
(0 .0 3 0 )
m in .
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
9 .6
9 .3
1 1 .5
1 1 .2
7 (0
8 (0
8 (0
8 (0
.3 8
.3 6
.4 5
.4 4
1 )
9 )
6 )
4 )
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
FEATURES
• Multi–base design for efficient energy
distribution across the chip resulting in
significantly improved switching and energy
ratings across full temperature range.
• Ion implant and high accuracy masking for
tight control of characteristics from batch to
batch.
• Triple Guard Rings for improved control of
high voltages.
SMD1 Package
Pad 1 – Base
Pad 2 – Collector
Pad 3 – Emitter
ABSOLUTE MAXIMUM RATINGS
(T
case
= 25°C unless otherwise stated)
V
CBO
V
CEO
V
EBO
I
C
I
C(PK)
I
B
P
tot
T
stg
R
th
Semelab plc.
Collector – Base Voltage
Collector – Emitter Voltage (I
B
= 0)
Emitter – Base Voltage
Collector Current
Peak Collector Current
Base Current
Total Dissipation at T
case
= 25°C
Derate above 25°C when used on efficient heatsink
Operating and Storage Temperature Range
Thermal Resistance Junction – Case
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
1000V
500V
10V
2A
4A
0.8A
35W
0.2W/°C
–65 to 200°C
3.5°C/W
Prelim. 7/00

BUL54ASMD-QR-B Related Products

BUL54ASMD-QR-B BUL54ASMDR4 BUL54ASMD-QR-BR4
Description 2A, 500V, NPN, Si, POWER TRANSISTOR, CERAMIC, SMD1, 3 PIN 2A, 500V, NPN, Si, POWER TRANSISTOR, CERAMIC, SMD1, 3 PIN 2A, 500V, NPN, Si, POWER TRANSISTOR, CERAMIC, SMD1, 3 PIN
Is it lead-free? Contains lead Lead free Lead free
Is it Rohs certified? incompatible conform to conform to
Maker SEMELAB SEMELAB SEMELAB
package instruction CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3 CHIP CARRIER, R-CBCC-N3
Contacts 3 3 3
Reach Compliance Code compliant compliant compliant
Shell connection COLLECTOR COLLECTOR COLLECTOR
Maximum collector current (IC) 2 A 2 A 2 A
Collector-emitter maximum voltage 500 V 500 V 500 V
Configuration SINGLE SINGLE SINGLE
Minimum DC current gain (hFE) 5 5 5
JESD-30 code R-CBCC-N3 R-CBCC-N3 R-CBCC-N3
Number of components 1 1 1
Number of terminals 3 3 3
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Polarity/channel type NPN NPN NPN
Certification status Not Qualified Not Qualified Not Qualified
surface mount YES YES YES
Terminal form NO LEAD NO LEAD NO LEAD
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
transistor applications SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON
Nominal transition frequency (fT) 20 MHz 20 MHz 20 MHz
JESD-609 code - e4 e4
Terminal surface - GOLD GOLD

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