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K3N3V3000D-GC10

Description
MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
Categorystorage    storage   
File Size45KB,3 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

K3N3V3000D-GC10 Overview

MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32

K3N3V3000D-GC10 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeSOIC
package instructionSOP,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
Other featuresTTL COMPATIBLE I/O
JESD-30 codeR-PDSO-G32
length20.47 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width11.43 mm
K3N3V(U)3000D-D(G)C
4M-Bit (512Kx8) CMOS MASK ROM
FEATURES
524,288 x 8 bit organization
Fast access time
3.3V Operation : 100ns(Max.)
3.0V Operation : 120ns(Max.)
Supply voltage : single +3.0V/ single +3.3V
Current consumption
Operating : 25mA(Max.)
Standby : 30µA(Max.)
Fully static operation
All inputs and outputs TTL compatible
Three state outputs
Package
-. K3N3V(U)3000D-DC : 32-DIP-600
-. K3N3V(U)3000D-GC : 32-SOP-525
CMOS MASK ROM
GENERAL DESCRIPTION
The K3N3V(U)3000D-D(G)C is a fully static mask programma-
ble ROM organized 524,288 x 8 bit. It is fabricated using silicon
gate CMOS process technology.
This device operates with 3.0V or 3.3V power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor, and
data memory, character generator.
The K3N3V(U)3000D-DC is packaged in a 32-DIP and the
K3N3V(U)3000D-GC in a 32-SOP.
FUNCTIONAL BLOCK DIAGRAM
A
18
X
BUFFERS
AND
DECODER
MEMORY CELL
MATRIX
(524,288x8)
PIN CONFIGURATION
.
.
.
.
.
.
.
.
A
0
N.C
A
16
A
15
1
2
3
4
5
6
7
8
9
32 V
CC
31 A
18
30 A
17
29 A
14
28 A
13
27 A
8
Y
BUFFERS
AND
DECODER
SENSE AMP.
BUFFERS
A
12
A
7
A
6
A
5
A
4
. . .
CE
OE
A
3
DIP
&
SOP
26 A
9
25 A
11
24 OE
23 A
10
21 CE
21 Q
7
20 Q
6
19 Q
5
18 Q
4
17 Q
3
A
2
10
CONTROL
LOGIC
Q
0
Q
7
A
1
11
A
0
12
Q
0
Q
1
Q
2
13
14
15
Pin Name
A
0
- A
18
Q
0
- Q
7
CE
OE
V
CC
V
SS
N.C
Pin Function
Address Inputs
Data Outputs
Chip Enable
Output Enable
Power
Ground
No Connection
V
SS
16
K3N3V(U)3000D-D(G)C

K3N3V3000D-GC10 Related Products

K3N3V3000D-GC10 K3N3V3000D-DC100 K3N3U3000D-GC120 K3N3U3000D-DC120 K3N3V3000D-DG10 K3N3U3000D-DG12 K3N3V3000D-GC100
Description MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 MASK ROM, 512KX8, 100ns, CMOS, PDIP32, 0.600 INCH, DIP-32 MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, SOP-32 MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 0.525 INCH, SOP-32 MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Parts packaging code SOIC DIP SOIC DIP SOIC SOIC SOIC
package instruction SOP, DIP, SOP, DIP, SOP, SOP, SOP,
Contacts 32 32 32 32 32 32 32
Reach Compliance Code unknown compliant compliant compliant unknown unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 100 ns 120 ns 120 ns 100 ns 120 ns 100 ns
JESD-30 code R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
length 20.47 mm 41.91 mm 20.47 mm 41.91 mm 20.47 mm 20.47 mm 20.47 mm
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP DIP SOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3 mm 5.08 mm 3 mm 5.08 mm 3 mm 3 mm 3 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.3 V 3.3 V 3.6 V 3.3 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 2.7 V 2.7 V 3 V 2.7 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3 V 3 V 3.3 V 3 V 3.3 V
surface mount YES NO YES NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 11.43 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm 11.43 mm 11.43 mm
Is it Rohs certified? - incompatible incompatible incompatible - - incompatible
Peak Reflow Temperature (Celsius) - NOT SPECIFIED 225 NOT SPECIFIED - - 225
Maximum time at peak reflow temperature - NOT SPECIFIED 30 NOT SPECIFIED - - 30
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