c. Maximum under Steady State conditions is 81 °C/W.
d. Package limited.
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
26
1.9
Maximum
33
2.4
Unit
°C/W
1
www.din-tek.jp
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= - 2 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= - 2 A, V
GS
= 0 V
- 0.75
28
20
13
15
T
C
= 25 °C
- 16
- 50
- 1.2
45
40
A
V
ns
nC
ns
b
DTL15P03
Symbol
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Test Conditions
V
GS
= 0 V, I
D
= - 250 µA
I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 25 V
V
DS
= - 30 V, V
GS
= 0 V
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
- 10 V, V
GS
= - 10 V
V
GS
= - 10 V, I
D
= - 10 A
V
GS
= - 4.5 V, I
D
= - 7 A
V
DS
= - 10 V, I
D
= - 10 A
Min.
- 30
Typ.
Max.
Unit
V
- 31
5.5
- 1.0
- 3.0
± 100
-1
-5
- 30
0.035
0.055
23
1960
0.043
0.070
mV/°C
V
nA
µA
A
Ω
S
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 10 A
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 10 A
f = 1 MHz
V
DD
= - 15 V, R
L
= 3
Ω
I
D
≅
- 5 A, V
GEN
= - 10 V, R
g
= 1
Ω
0.3
380
325
43
22
6
11
1.3
11
13
32
9
44
2.5
22
25
50
18
70
160
50
30
65
33
pF
nC
Ω
ns
V
DD
= - 15 V, R
L
= 3
Ω
I
D
≅
- 5 A, V
GEN
= - 4.5 V, R
g
= 1
Ω
100
28
15
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
60
V
GS
= 10 thru 5
V
4
I
D
- Drain Current (A)
5
www.din-tek.jp
DTL15P03
50
I
D
- Drain Current (A)
40
V
GS
= 4
V
30
3
2
V
GS
= 125 °C
1
20
10
V
GS
= 3
V
0
0
1
2
3
4
5
V
GS
= 25 °C
0
0
1
2
3
V
GS
= - 55 °C
4
5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.05
3000
Transfer Characteristics
R
DS(on)
- On-Resistance (Ω)
0.04
C - Capacitance (pF)
2400
C
iss
1800
0.03
V
GS
= 4.5
V
0.02
V
GS
= 10
V
0.01
1200
C
oss
600
C
rss
0
0
10
20
30
40
50
60
0
0
6
12
18
24
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current
10
I
D
= 10 A
V
GS
- Gate-to-Source
Voltage
(V)
8
R
DS(on)
- On-Resistance
V
DS
= 10
V
6
V
DS
= 20
V
4
V
DS
= 15
V
1.4
1.6
I
D
= 10 A
Capacitance
V
GS
= - 10
V
(Normalized)
1.2
V
GS
= - 4.5
V
1.0
2
0.8
0
0
10
20
30
40
50
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
0.10
I
D
= 10 A
R
DS(on)
- On-Resistance (Ω)
10
I
S
- Source Current (A)
T
J
= 150 °C
T
J
= 25 °C
0.08
www.din-tek.jp
DTL15P03
1
0.06
0.1
0.04
T
J
= 125 °C
0.02
T
J
= 25 °C
0.01
0.001
0.0
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.8
50
On-Resistance vs. Gate-to-Source Voltage
0.6
I
D
= 5 mA
V
GS(th)
Variance
(V)
0.4
Power (W)
40
30
0.2
I
D
= 250
µA
20
0.0
10
- 0.2
- 0.4
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
I
D
- Drain Current (A)
10
Single Pulse Power, Junction-to-Ambient
1 ms
10 ms
1
100 ms
1s
10 s
T
A
= 25 °C
Single Pulse
0.01
0.01
0.1
1
10
DC
0.1
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area
4
MOSFET TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
45
www.din-tek.jp
DTL15P03
36
I
D
- Drain Current (A)
27
18
Package Limited
9
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
65
2.0
52
1.6
Power (W)
26
Power (W)
0
39
1.2
0.8
13
0.4
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Power, Junction-to-Case
Power Derating, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
[i=s]This post was last edited by dontium on 2015-1-23 13:23[/i]
Keywords: Impedance tracking, battery backup, lithium-ion batteries, Texas Instruments, TIBy Keith Keller, Analog Field Applications / ...
I am studying electronic engineering, but I always have no idea what to do at work! I always feel that what I have learned is not solid and it is difficult to connect it with actual work. Please give ...
Using TI's LM3S6911, operating 24C256 in interrupt mode, if single-byte reading and writing, it is completely correct, but if reading from 00 to 3F or from any value in the middle, such as 08 to 3F, t...
How can I simulate without a serial port? I spent most of the time to adjust the serial port. The program is not my own, but the example program in the forum... Don't look down on me, I have just star...
After evaluation by Weixue engineers, the friends who have obtained trial qualifications are as follows: [url=https://home.eeworld.com.cn/space-uid-77328.html]ltbytyn[/url] [url=https://home.eeworld.c...
It is a fact that the only way for electronic design is to go digital. On the road of digitalization, the development of electronic design technology in my country has experienced many major changes a...
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
How do you know if a machine is operating properly? The answer: by leveraging deep learning to detect anomalies in routine vibration data from industrial machines. Anomaly detection has many uses, ...[Details]
As the main model among new energy vehicles, pure electric vehicles have received strong support and encouragement from the country in recent years, and their development is changing with each pass...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
Compared to cloud databases, minicomputers are purpose-built for decentralized, rugged computing at the edge of the network. By moving applications, analytics, and processing services closer to the...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
For new energy vehicles, the importance of batteries is unquestionable. Not only does it determine the performance of the vehicle, but the battery density also has a great relationship with the veh...[Details]
On August 21, according to a report by Korean media SEDaily yesterday, according to semiconductor industry sources, the HBM4 samples provided by Samsung to Nvidia last month have passed initial tes...[Details]